BUK9K22-80EX

BUK9K22-80EX

$1.68
  • Description:MOSFET 2N-CH 80V 21A LFPAK56D
  • Series:-

SKU:4d6625561f4d Category: Brand:

  
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Product Detailed Parameters

  • Description:MOSFET 2N-CH 80V 21A LFPAK56D
  • Series:-
  • Mfr:Nexperia USA Inc.
  • Package:Tape & Reel (TR),Cut Tape (CT)
  • Technology:MOSFET (Metal Oxide)
  • Configuration:2 N-Channel (Dual)
  • FET Feature:Logic Level Gate
  • Drain to Source Voltage (Vdss):80V
  • Current - Continuous Drain (Id) @ 25°C:21A (Ta)
  • Rds On (Max) @ Id, Vgs:19mOhm @ 10A, 10V
  • Vgs(th) (Max) @ Id:2.1V @ 1mA
  • Gate Charge (Qg) (Max) @ Vgs:23.1nC @ 5V
  • Input Capacitance (Ciss) (Max) @ Vds:3115pF @ 25V
  • Power - Max:64W
  • Operating Temperature:-55°C ~ 175°C (TJ)
  • Mounting Type:Surface Mount
  • Package / Case:SOT-1205, 8-LFPAK56
  • Supplier Device Package:LFPAK56D
  • Grade:Automotive
  • Qualification:AEC-Q101

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BUK9K22-80EX

Overview

The Nexperia BUK9K22-80EX is a dual N-channel logic level MOSFET housed in an LFPAK56D (SOT1205) package. It utilizes TrenchMOS technology and meets AEC-Q101 standards for automotive applications. Key electrical parameters include a drain-source voltage of 80 V, a continuous drain current of 21 A at 25 °C mounting base temperature, and a total power dissipation of 64 W. The on-state resistance is typically 15.7 mΩ at 25 °C and 54.5 mΩ at 175 °C junction temperature when driven by a 5 V gate-source voltage. Total gate charge is 23.1 nC.

Feature Summary

  • Dual MOSFET configuration within a single surface-mounted package
  • Automotive qualified to AEC-Q101 standard for high performance environments
  • Logic level gate operation with low threshold voltage at elevated temperatures
  • Repetitive avalanche rated for robustness in switching applications

Applications

  • 12 V, 24 V and 48 V automotive systems
  • Motors, lamps and solenoid control
  • Transmission control
  • Ultra high performance power switching

Procurement Notes

Verify the specific suffix 'EX' against the official datasheet to confirm packaging details such as reel or cut tape specifications. Ensure the component matches the SOT1205 package outline dimensions. Confirm that the marking code corresponds to the correct part number before integration into production designs.

Selection Notes

Select this component for designs requiring dual isolated channels in a compact footprint. The logic level gate drive allows direct interfacing with standard microcontrollers without additional level shifting circuitry. Consider the thermal resistance characteristics when designing heat dissipation strategies for high-current loads.

Part Context

This device belongs to Nexperia's TrenchMOS family, designed for efficiency and reliability. The LFPAK56D package provides enhanced thermal performance compared to traditional plastic packages. It is intended for use in demanding environments where space constraints and thermal management are critical factors in system design.

Replacement Considerations

BUK9K22-80E is the equivalent non-reel variant. Verify pinout compatibility and thermal characteristics when substituting.

BUK9K22-80EXBUK9K22-80EX
$1.68
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