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The CA3227M96 is a high-frequency NPN transistor array manufactured by Intersil, designed for low-power applications at frequencies up to 1.5GHz. The component consists of five general-purpose silicon NPN transistors housed in a 16-SOIC surface-mount package. Key electrical specifications include a collector-emitter voltage rating of 8V, a maximum collector current of 20mA, and a transition frequency (fT) of 3GHz. The device supports a maximum power dissipation of 85mW, making it suitable for RF signal processing tasks requiring compact integration and efficient thermal management within constrained PCB layouts.
Verify the manufacturer source carefully as Intersil has undergone corporate acquisitions; ensure the supplier provides documentation confirming the part originates from the correct lineage. Confirm the 16-SOIC package type matches your board footprint requirements. Check for RoHS compliance status if required by your manufacturing standards. Validate that the 85mW power dissipation limit aligns with your thermal design constraints before finalizing procurement orders.
Select this component when designing circuits requiring multiple NPN transistors with high-speed capabilities in a minimal footprint. The 3GHz transition frequency makes it appropriate for applications operating near or below 1.5GHz. Ensure your design accounts for the 8V voltage limit and 20mA current constraint. Consider the 16-SOIC package for automated assembly processes where space is limited compared to through-hole alternatives.
This device belongs to the CA3227 family of high-frequency NPN transistor arrays. It represents a specialized solution for integrating multiple active elements into RF systems without increasing board area. The 16-SOIC packaging facilitates surface-mount technology implementation, supporting modern electronics manufacturing techniques while maintaining performance characteristics essential for analog and mixed-signal RF designs.
Public confirmed substitute part numbers are not available in the provided documentation. Verify compatibility with alternative components based on matching pinout configurations, electrical ratings, and package dimensions before substitution.