SEARCH
— IC芯片 | 连接器 | 传感器 | 被动器件 —
The Wolfspeed CAB006M12GM3T is a baseplate-less Silicon Carbide (SiC) half-bridge power module rated for 1200 V drain-source voltage and 6 mΩ on-state resistance. It features press-fit pins for assembly and includes pre-applied phase change thermal interface material. The module supports a continuous drain current of 200 A at a heatsink temperature of 50 °C, with a maximum virtual junction temperature of 175 °C. Key electrical parameters include an internal gate resistance of 1.1 Ω, input capacitance of 20.4 nF, and a junction-to-heatsink thermal resistance of 0.234 °C/W.
Verify the specific ordering suffix when purchasing components. The suffix 'T' indicates that the module includes pre-applied phase change thermal interface material, whereas the non-suffixed version does not. Confirming this distinction is essential to ensure the correct thermal management specifications are met for the intended application design.
Select this component based on its 1200 V blocking capability and low on-resistance for high-efficiency power conversion. Consider the 200 A continuous current rating relative to the heatsink temperature requirements. The press-fit mounting style requires compatible PCB or busbar structures, and the inclusion of pre-applied TIM simplifies the thermal interface preparation process during system integration.
This part belongs to the WolfPACK family of baseplate-less modules, which are optimized for medium power applications. The WolfPACK series provides industry-standard footprints to support scalability and reduce assembly overhead. This specific model utilizes Wolfspeed's third-generation Silicon Carbide technology to enhance system-level efficiency and power density.
Publicly confirmed substitute part numbers are not available in the provided documentation. Designers should consult official Wolfspeed resources or technical support for validated alternative components that meet identical electrical and mechanical specifications.
The primary difference is the thermal interface material. The CAB006M12GM3T comes with pre-applied phase change thermal interface material, while the CAB006M12GM3 does not.
The module supports a virtual junction temperature up to 150 °C for standard operation and up to 175 °C for intermittent operation with reduced life.
The module uses press-fit pins for assembly, eliminating the need for traditional screw mounting hardware.