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CC2630F128RSMT is listed in the RF Transceiver ICS range at ChipApex. The manufacturer field lists Texas Instruments. Its product description is IC RF TXRX+MCU 802.15.4 32VQFN. Review the specifications below when checking this part for your BOM.
The CC2630F128RSMT is a SimpleLink ultra-low-power wireless MCU from Texas Instruments, featuring an ARM Cortex-M3 core. It integrates a 2.4 GHz RF transceiver supporting IEEE 802.15.4, Zigbee, and 6LoWPAN protocols. The device includes 128 kB of flash memory and 28 kB of SRAM. It operates within a voltage range of 1.8 V to 3.8 V and supports data rates up to 250 kbps with a maximum output power of 5 dBm. Sensitivity reaches -100 dBm. The component is housed in a 32-VQFN package with exposed pads, suitable for surface mount installation across an operating temperature range of -40°C to +85°C.
Verify the specific suffix 'T' indicates tape-and-reel packaging configuration when sourcing. Confirm the component status remains active for new designs. Ensure compatibility with the 32-VQFN footprint and exposed pad thermal requirements during PCB layout. Check for any recent product change notices regarding assembly sites or material composition updates prior to finalizing procurement orders.
Choose this model for applications requiring integrated Zigbee and 6LoWPAN support with low power constraints. The 128 kB flash capacity suits moderate firmware complexity. Consider the 32-VQFN package size for space-constrained designs. Evaluate the -100 dBm sensitivity against link budget requirements. Compare against other SimpleLink variants if higher output power or different protocol stacks are needed.
This part belongs to the CC2630 family of SimpleLink wireless MCUs. It shares architectural similarities with the CC2630F128RHBT but differs in packaging and reel configuration. The series targets low-cost, high-volume IoT deployments requiring robust wireless mesh networking capabilities within a compact form factor.
CC2630F128RSMR is a related variant with identical electrical specifications but potentially different packaging handling characteristics. Verify pinout and thermal pad requirements remain consistent when substituting.
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