CGH09120F

CGH09120F

$254.28
  • Description:RF MOSFET HEMT 28V 440095
  • Series:GaN

SKU:4625f4d66a81 Category: Brand:

  
  • Quantity
    • -
    • +
  •    
ChipApex WhatsApp

Consult the customer manager about the wholesale price.

consultation hotline:86-132-6715-2157

email:[email protected]
Contact the product manager for consultation. One-stop consultation is available.


Do you want a lower wholesale price? Please send us your inquiry and we will reply immediately.

Submitting!
Submission successful!
Submission failed!
Email error!
Phone number error!

Product Detailed Parameters

  • Description:RF MOSFET HEMT 28V 440095
  • Series:GaN
  • Mfr:MACOM Technology Solutions
  • Package:Tray
  • Technology:HEMT
  • Frequency:2.5GHz
  • Gain:21.5dB
  • Voltage - Test:28 V
  • Current Rating (Amps):-
  • Noise Figure:-
  • Current - Test:1.2 A
  • Power - Output:120W
  • Voltage - Rated:84 V
  • Grade:-
  • Qualification:-
  • Mounting Type:-
  • Package / Case:440095
  • Supplier Device Package:440095
  • Configuration:-

Download product information

CGH09120F

Overview

The CGH09120F is a gallium nitride (GaN) high electron mobility transistor (HEMT) designed for UHF to 2.5 GHz operation. It delivers 120 W saturated output power with 21 dB gain at 28 V drain bias. The device operates within a frequency range of 800 MHz to 950 MHz, achieving 35% efficiency and -38 dBc ACLR at 20 W average power. It features a ceramic/metal flange package (440095), supports up to 10:1 VSWR mismatch stress, and includes large signal models for ADS and MWO.

Feature Summary

  • High efficiency and wide bandwidth capabilities optimized for linear amplifier applications
  • Robust performance under high voltage mismatch stress conditions
  • Supports extensive digital pre-distortion correction techniques

Applications

  • WCDMA base station amplifiers
  • LTE cellular infrastructure
  • MC-GSM transmission systems

Procurement Notes

Verify the specific datasheet revision against the manufacturer's official documentation before finalizing design specifications. Confirm that the required thermal management solutions align with the junction-to-case thermal resistance parameters provided in the electrical characteristics table. Ensure compliance with export control classifications listed in the product documentation.

Selection Notes

Select this component when designing amplifiers requiring high linearity and power density in the UHF band. Evaluate the need for DPD algorithms to optimize spectral purity. Consider the 440095 package dimensions for PCB layout and mechanical mounting constraints. Verify compatibility with standard RF test equipment for characterization.

Part Context

This part belongs to MACOM's GaN HEMT portfolio, specifically engineered for broadband wireless communication infrastructure. It utilizes silicon carbide substrates to achieve superior thermal conductivity and breakdown voltage compared to traditional silicon devices. The technology enables compact designs with high power density.

Replacement Considerations

Consult the manufacturer's official substitution guide for verified alternatives. Cross-reference pinouts and thermal characteristics carefully when considering generic replacements.

FAQ

What is the maximum allowable drain-source voltage?

The absolute maximum rating for Drain-Source Voltage (VDSS) is 120 V.

Does the device support high VSWR loads?

Yes, it can withstand an output mismatch stress VSWR of up to 10:1 at all phase angles without damage.

Is digital pre-distortion supported?

Yes, the datasheet indicates a high degree of DPD correction can be applied to improve linearity.

CGH09120FCGH09120F
$254.28
Buy Now