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The CGH09120F is a gallium nitride (GaN) high electron mobility transistor (HEMT) designed for UHF to 2.5 GHz operation. It delivers 120 W saturated output power with 21 dB gain at 28 V drain bias. The device operates within a frequency range of 800 MHz to 950 MHz, achieving 35% efficiency and -38 dBc ACLR at 20 W average power. It features a ceramic/metal flange package (440095), supports up to 10:1 VSWR mismatch stress, and includes large signal models for ADS and MWO.
Verify the specific datasheet revision against the manufacturer's official documentation before finalizing design specifications. Confirm that the required thermal management solutions align with the junction-to-case thermal resistance parameters provided in the electrical characteristics table. Ensure compliance with export control classifications listed in the product documentation.
Select this component when designing amplifiers requiring high linearity and power density in the UHF band. Evaluate the need for DPD algorithms to optimize spectral purity. Consider the 440095 package dimensions for PCB layout and mechanical mounting constraints. Verify compatibility with standard RF test equipment for characterization.
This part belongs to MACOM's GaN HEMT portfolio, specifically engineered for broadband wireless communication infrastructure. It utilizes silicon carbide substrates to achieve superior thermal conductivity and breakdown voltage compared to traditional silicon devices. The technology enables compact designs with high power density.
Consult the manufacturer's official substitution guide for verified alternatives. Cross-reference pinouts and thermal characteristics carefully when considering generic replacements.
The absolute maximum rating for Drain-Source Voltage (VDSS) is 120 V.
Yes, it can withstand an output mismatch stress VSWR of up to 10:1 at all phase angles without damage.
Yes, the datasheet indicates a high degree of DPD correction can be applied to improve linearity.