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The CMPA1F1H060D is a radio frequency amplifier die from MACOM Technology Solutions, utilizing the G28V5-1C EE SC Au process. It is classified as an RF amplifier within the Wireless & RF Integrated Circuits subcategory. The component is supplied in a tray package with a factory quantity of 10 units per tray. This product represents a new introduction from the manufacturer and is subject to restricted supply conditions.
Verify current availability status as the item is listed under restricted supply conditions. Confirm that the specific G28V5-1C EE SC Au die configuration matches your design requirements. Ensure compliance with any customs documentation or additional fees associated with delivery restrictions. Check for recent Product Change Notifications (PCN) dated April 25, 2024, regarding potential specification updates or manufacturing changes before finalizing procurement plans.
Select this component when a bare RF amplifier die is required rather than a packaged module. Consider the G28V5-1C process capabilities for specific frequency and power performance needs. Evaluate the tray packaging format against your assembly line handling capabilities. Review the official datasheet for detailed electrical parameters not included in this summary to ensure compatibility with system impedance and biasing requirements.
This part belongs to the MACOM Technology Solutions portfolio of wireless and RF integrated circuits. It is distinct from evaluation boards like the CMPA1E1F060D-AMP or other MMIC variants such as the CMPA0335030F-AMP. The CMPA1F1H060D specifically refers to the semiconductor die itself, intended for integration into larger RF assemblies or custom packages by the end user.
Publicly confirmed substitute part numbers are not available in the provided source data. Verify if other dies within the same G28V5-1C family offer compatible pinouts or electrical characteristics. Consult MACOM directly for recommended alternatives if this specific die is discontinued or unavailable.