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CP307-CZTA27-CT is listed in the Single Bipolar Transistors range at ChipApex. The manufacturer field lists Central Semiconductor Corp. Its product description is TRANS NPN DARL 60V 0.5A DIE. Review the specifications below when checking this part for your BOM.
The CP307-CZTA27-CT is a bare die NPN silicon Darlington transistor manufactured using the Central Semiconductor CP307 epitaxial planar process. The component features a die size of 27 x 27 mils and a thickness of 9.0 mils. It utilizes aluminum top-side metalization measuring 30,000 angstroms and gold back-side metalization at 18,000 angstroms. The device is supplied in a singulated waffle tray configuration designated by the CT suffix.
Verify that the CP307 wafer process is classified as End of Life. Confirm if existing inventory satisfies project requirements or if transition to the replacement CP327V-CZTA27-CT is necessary. Check for minimum order quantity constraints associated with the waffle pack packaging format.
Select this component when specific CP307 process characteristics are required for legacy designs. Ensure the application supports bare die integration methods. Evaluate the electrical parameters against the CP327V replacement process if design flexibility allows for migration to the newer wafer technology.
This part belongs to the CP307 family of small signal transistors produced by Central Semiconductor Corp. The CP307 process is being discontinued and replaced by the CP327V process. The CZTA27 designation indicates the specific transistor type within this process line.
The official replacement part number is CP327V-CZTA27-CT. This substitution reflects the transition from the discontinued CP307 wafer process to the CP327V process while maintaining the same device type and packaging format.
The CP307 wafer process is classified as End of Life (EOL).
The CT suffix indicates the die is singulated and packed in a waffle tray.
The official replacement is CP327V-CZTA27-CT.
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