Memory IC CY7C1320KV18-250BZXC product image

CY7C1320KV18-250BZXC

$19.62
  • Description:IC SRAM 18MBIT PAR 165FBGA
  • Series:-
  • Mfr:Infineon Technologies
  • Package:Tray,Tray

SKU:ee15673e56f4 Category: Brand:

  
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CY7C1320KV18-250BZXC is listed in the Memory IC range at ChipApex. The manufacturer field lists Infineon Technologies. Its product description is IC SRAM 18MBIT PAR 165FBGA. Review the specifications below when checking this part for your BOM.

Memory IC specifications for CY7C1320KV18-250BZXC

  • Description:IC SRAM 18MBIT PAR 165FBGA
  • Series:-
  • Mfr:Infineon Technologies
  • Package:Tray,Tray
  • Memory Type:Volatile
  • Memory Format:SRAM
  • Technology:SRAM - Synchronous, DDR II
  • Memory Size:18Mbit
  • Memory Organization:512K x 36
  • Memory Interface:Parallel
  • Clock Frequency:250 MHz
  • Write Cycle Time - Word, Page:-
  • Voltage - Supply:1.7V ~ 1.9V
  • Operating Temperature:0°C ~ 70°C (TA)
  • Mounting Type:Surface Mount
  • Package / Case:165-LBGA
  • Supplier Device Package:165-FBGA (13x15)
  • Access Time:-

Memory IC datasheet and documents for CY7C1320KV18-250BZXC

CY7C1320KV18-250BZXC

Memory IC Overview

The CY7C1320KV18-250BZXC is a 18 Mbit Synchronous Static Random Access Memory (SRAM) belonging to the QDR II family. It features a memory organization of 512K x 36 bits and operates with a maximum clock frequency of 250 MHz. The device utilizes a parallel interface and requires a supply voltage between 1.7 V and 1.9 V, with a maximum power consumption of 900 mA. It supports a two-word burst access mode and is housed in an FBGA-165 package suitable for surface mount installation.

Memory IC Feature Summary

  • Supports high-speed synchronous data transfer via a parallel interface architecture
  • Enables efficient data handling through a two-word burst access mode
  • Operates within a standard commercial temperature range for reliable performance

Memory IC Applications

  • High-performance networking equipment requiring low-latency buffering
  • Telecommunications systems utilizing QDR II interface standards
  • Industrial control applications needing fast random access memory

Memory IC Procurement Notes

Verify component authenticity by checking manufacturer markings against official datasheets. Confirm package integrity and pin alignment prior to assembly. Ensure compliance with RoHS directives if required by your specific manufacturing standards. Review humidity sensitivity levels for proper storage and reflow soldering profiles to prevent damage during production.

Memory IC Selection Notes

Select this component when a 512K x 36 organization is required for QDR II compatible designs. It is suitable for systems operating at 250 MHz with 1.8V logic levels. Consider the FBGA-165 footprint for PCB layout constraints. Verify that the 900 mA current draw fits within the system's power budget and thermal management capabilities.

Memory IC Part Context

This part belongs to Infineon's QDR II SRAM family, designed for high-throughput applications. It shares architectural similarities with other members like the CY7C1314JV18-250BZXC but differs in organization and interface specifics. The series emphasizes speed and efficiency for data-intensive tasks in networking and telecom sectors.

Memory IC Replacement Considerations

Publicly confirmed substitute part numbers are not available in the provided documentation. Evaluate alternative components based on matching pinout, voltage requirements, and timing specifications. Consult official replacement guides or contact the manufacturer directly for qualified alternatives.

CY7C1320KV18-250BZXCCY7C1320KV18-250BZXC
$19.62
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