CY7C1513AV18-200BZI

Memory IC Overview

The CY7C1513AV18-200BZI is a 72-Mbit QDR-II SRAM with a 4M x 18 organization. It operates at a maximum frequency of 200 MHz and supports concurrent read/write transactions via separate ports. The device uses a 165-Ball FBGA package (15 x 17 mm) and requires a core voltage of 1.8V ± 0.1V. It features a Delay Lock Loop for accurate data placement, echo clocks to minimize skew, and programmable impedance matching.

Memory IC Feature Summary

• Supports concurrent independent read and write operations using separate data ports to eliminate bus turnaround.
• Features a 4-word burst architecture that reduces address bus frequency requirements while maximizing throughput.
• Includes echo clocks referenced to output clocks to simplify data capture in high-speed systems.
• Provides programmable output driver impedance via an external resistor connected to the ZQ pin.

Memory IC Applications

• High-bandwidth networking equipment requiring low-latency memory access
• Telecommunications infrastructure utilizing synchronous pipelined SRAM
• Industrial control systems needing full data coherency during concurrent transactions

Memory IC Procurement Notes

Verify the specific ordering suffix 'BZI' against official Infineon documentation to confirm lead-free status and temperature grade. Ensure the design accounts for the 165-ball FBGA footprint dimensions and thermal requirements. Confirm that the system power supply meets the strict 1.8V ± 0.1V core voltage specification for reliable operation.

Memory IC Selection Notes

Select this component when a 72-Mbit capacity with a 18-bit data width is required. The 200 MHz speed grade suits applications where lower power consumption is prioritized over the highest possible bandwidth available in faster variants. Ensure the PCB layout supports the necessary differential clock routing for the K/K and C/C pairs.

Memory IC Part Context

This part belongs to the CY7C151xAV18 family of QDR-II SRAMs manufactured by Infineon Technologies. The family includes variants with different densities and widths, such as the CY7C1511AV18 (8M x 8) and CY7C1515AV18 (2M x 36). All members share the same QDR-II architecture and 165-ball FBGA package form factor.

Memory IC Replacement Considerations

Direct replacements within the same family include CY7C1513KV18-200BZXI. Verify compatibility regarding the manufacturing process node and environmental compliance specifications before substitution.