Memory IC CY7C15632KV18-450BZC product image

CY7C15632KV18-450BZC

$203.77
  • Description:IC SRAM 72MBIT PAR 165FBGA
  • Series:-
  • Mfr:Cypress Semiconductor Corp
  • Package:Bulk,Tray

SKU:f8f8a0e77ca3 Category: Brand:

  
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CY7C15632KV18-450BZC is listed in the Memory IC range at ChipApex. The manufacturer field lists Cypress Semiconductor Corp. Its product description is IC SRAM 72MBIT PAR 165FBGA. Review the specifications below when checking this part for your BOM.

Memory IC specifications for CY7C15632KV18-450BZC

  • Description:IC SRAM 72MBIT PAR 165FBGA
  • Series:-
  • Mfr:Cypress Semiconductor Corp
  • Package:Bulk,Tray
  • Memory Type:Volatile
  • Memory Format:SRAM
  • Technology:SRAM - Synchronous, QDR II+
  • Memory Size:72Mbit
  • Memory Organization:4M x 18
  • Memory Interface:Parallel
  • Clock Frequency:450 MHz
  • Write Cycle Time - Word, Page:-
  • Voltage - Supply:1.7V ~ 1.9V
  • Operating Temperature:0°C ~ 70°C (TA)
  • Mounting Type:Surface Mount
  • Package / Case:165-LBGA
  • Supplier Device Package:165-FBGA (13x15)
  • Access Time:-

Memory IC datasheet and documents for CY7C15632KV18-450BZC

CY7C15632KV18-450BZC

Memory IC Overview

The CY7C15632KV18-450BZC is a 72-Mbit QDR II SRAM featuring a four-word burst architecture with 2.5-cycle read latency and On-Die Termination (ODT). It operates at a maximum clock frequency of 450 MHz with a 450 ps access time. The device uses a 4M x 18 organization and supports parallel interfaces. Power supply voltage ranges from 1.7 V to 1.9 V, with a maximum current consumption of 780 mA. It is housed in a 165-pin FBGA package measuring 13x15 mm and functions within an operating temperature range of 0°C to +70°C.

Memory IC Feature Summary

  • QDR II technology enables simultaneous input and output data transfers for high bandwidth
  • Four-word burst architecture provides efficient sequential data access
  • On-Die Termination (ODT) improves signal integrity on high-speed buses

Memory IC Applications

  • High-performance networking equipment
  • Telecommunications infrastructure
  • Data center storage systems

Memory IC Procurement Notes

Verify the specific suffix 'BZC' against official Infineon or Cypress documentation to confirm pinout, lead finish, and RoHS compliance status. Confirm that the 165-FBGA footprint matches your PCB design constraints. Ensure the 1.8V power domain requirements are met by your system design before procurement.

Memory IC Selection Notes

Select this component when a 72-Mbit capacity with 450 MHz synchronous performance is required. The QDR II interface is suitable for applications needing independent read and write ports. Consider the 165-pin package size and thermal characteristics during board layout planning.

Memory IC Part Context

This part belongs to the CY7C15632KV18 family of QDR II SRAMs manufactured by Cypress Semiconductor, now part of Infineon Technologies. These devices are designed for high-speed memory applications requiring low latency and high throughput. The family typically includes variants with different speeds and organizations.

Memory IC Replacement Considerations

Check for direct substitutes within the CY7C15632 series with compatible speed grades. Verify pin-to-pin compatibility with other 165-pin FBGA QDR II SRAMs if cross-vendor sourcing is necessary.

CY7C15632KV18-450BZCCY7C15632KV18-450BZC
$203.77
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