Telecom CYP15G0201DXB-BBXC product image

CYP15G0201DXB-BBXC

  • Description:IC TELECOM INTERFACE 196FBGA
  • Series:HOTlink II™

SKU:9ca79760d872 Category: Brand:

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CYP15G0201DXB-BBXC is listed in the Telecom range at ChipApex. The manufacturer field lists Infineon Technologies. Its product description is IC TELECOM INTERFACE 196FBGA. Review the specifications below when checking this part for your BOM.

Telecom specifications for CYP15G0201DXB-BBXC

  • Description:IC TELECOM INTERFACE 196FBGA
  • Series:HOTlink II™
  • Mfr:Infineon Technologies
  • Package:Tray
  • Function:Transceiver
  • Interface:LVTTL
  • Number of Circuits:2
  • Voltage - Supply:3.135V ~ 3.465V
  • Current - Supply:570mA
  • Operating Temperature:0°C ~ 70°C
  • Mounting Type:Surface Mount
  • Package / Case:196-LBGA
  • Supplier Device Package:196-FBGA (15x15)
  • Power (Watts):-
  • Grade:-
  • Qualification:-

Telecom datasheet and documents for CYP15G0201DXB-BBXC

CYP15G0201DXB-BBXC

Telecom Overview

The CYP15G0201DXB-BBXC is a dual-channel video COM transceiver from Infineon Technologies, belonging to the HOTLink series. It operates within a supply voltage range of 3.135 V to 3.465 V and draws a maximum operating current of 700 mA. The device supports two channels and is housed in an FBGA-196 surface-mount package. It functions reliably across a temperature range of 0°C to +70°C. This component is classified as a telecom interface IC designed for high-speed serial data transmission applications.

Telecom Feature Summary

  • Dual-channel architecture for simultaneous video data transmission
  • HOTLink technology enabling high-speed serial communication
  • Surface-mount design compatible with automated assembly processes

Telecom Applications

  • Telecommunications infrastructure equipment
  • Video transmission systems requiring serial interfaces
  • Industrial control systems utilizing HOTLink protocols

Telecom Procurement Notes

Verify component authenticity through authorized Infineon distributors or certified partners. Confirm the specific suffix BBXC matches project requirements. Check for moisture sensitivity handling instructions due to the FBGA package type. Ensure compliance with RoHS directives relevant to the manufacturing date code. Validate that the discontinued status does not impact long-term supply chain stability.

Telecom Selection Notes

Select this model when dual-channel HOTLink compatibility is required for video interfaces. Compare power consumption against single-channel alternatives if bandwidth needs are lower. Consider the FBGA-196 footprint constraints during PCB layout planning. Verify thermal management capabilities given the 700 mA current draw at standard operating temperatures.

Telecom Part Context

This part belongs to the CYV15G/CYP15G HOTLink family, which provides serial interconnect solutions. It shares architectural similarities with other HOTLink transceivers but offers specific channel counts and packaging options. The product line focuses on reliable high-speed data transfer for embedded and telecom applications.

Telecom Replacement Considerations

Publicly confirmed substitute part numbers are not available in the provided documentation. The component status is listed as discontinued. Engineers should consult official Infineon lifecycle notices for potential obsolescence management strategies or approved alternative families.

CYP15G0201DXB-BBXCCYP15G0201DXB-BBXC

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