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The Infineon DDB6U180N16RR_B11 is an EconoPACK™2 IGBT module featuring Trench/Fieldstop IGBT4 and Emitter Controlled 4 diode technology with PressFIT connections. It integrates a half-controlled bridge topology with a brake chopper. The rectifier section supports a maximum repetitive peak reverse voltage of 1600 V, a maximum RMS forward current per chip of 150 A at TC=80°C, and a surge forward current limit of 1600 A. The integrated brake chopper IGBT provides a collector-emitter voltage of 1200 V, a continuous DC collector current of 100 A at TC=80°C, and a repetitive peak collector current of 200 A.
Verify the specific ordering suffix against official documentation to confirm exact configuration details. Confirm that the component meets RoHS compliance standards required for your assembly process. Ensure compatibility with PressFIT mounting tools and verify isolation test voltage requirements for your system design.
Select this module for applications requiring a half-controlled bridge with integrated braking capability. Evaluate the thermal resistance values relative to your heatsink design to ensure junction temperatures remain within the specified operating range. Consider the 1200 V rating of the brake chopper IGBT when sizing the DC bus voltage.
This component belongs to the Infineon EconoBRIDGE™ family, specifically designed as a half-controlled bridge with a brake chopper. It utilizes the EconoPACK™2 housing format, which is standardized for industrial power electronics. The module combines rectifier and brake chopper functions into a single compact unit.
Publicly confirmed substitute part numbers are not available in the provided source material. Verify pinout and electrical parameters carefully if considering alternative manufacturers or different series modules.
The maximum repetitive peak reverse voltage (VRRM) for the rectifier diodes is 1600 V at a junction temperature of 25°C.
The collector-emitter voltage (VCES) for the brake chopper IGBT is rated at 1200 V at a junction temperature of 25°C.
The module uses PressFIT contact technology, which allows for direct insertion into plated-through holes without soldering.