DF23MR12W1M1B11BOMA1

Description：MOSFET 2N-CH 1200V AG-EASY1BM-2
Series：-

SKU:e1206c9f0dba Category: FET, MOSFET Arrays Brand: Infineon Technologies

Consult the customer manager about the wholesale price.

consultation hotline：86-132-6715-2157

email：[email protected]
Contact the product manager for consultation. One-stop consultation is available.

Do you want a lower wholesale price? Please send us your inquiry and we will reply immediately.

Product introduction

Product Detailed Parameters

Description：MOSFET 2N-CH 1200V AG-EASY1BM-2
Series：-
Mfr：Infineon Technologies
Package：Tray
Technology：Silicon Carbide (SiC)
Configuration：2 N-Channel (Dual)
FET Feature：-
Drain to Source Voltage (Vdss)：1200V (1.2kV)
Current - Continuous Drain (Id) @ 25°C：25A
Rds On (Max) @ Id, Vgs：45mOhm @ 25A, 15V
Vgs(th) (Max) @ Id：5.5V @ 10mA
Gate Charge (Qg) (Max) @ Vgs：620nC @ 15V
Input Capacitance (Ciss) (Max) @ Vds：2000pF @ 800V
Power - Max：-
Operating Temperature：-40°C ~ 150°C (TJ)
Mounting Type：Chassis Mount
Package / Case：Module
Supplier Device Package：AG-EASY1BM-2
Grade：-
Qualification：-

Download product information

DF23MR12W1M1B11BOMA1

Overview

The DF23MR12W1M1_B11 is an EasyPACK module containing CoolSiC Trench MOSFETs and integrated NTC sensors. It features a 1200 V drain-source voltage, 25 A nominal DC current at 70°C ambient, and a maximum pulsed current of 50 A. The on-resistance is 45 mΩ at 25°C. Operating temperature ranges from -40°C to 150°C. It utilizes PressFIT contact technology for robust mounting.

Feature Summary

Integrates CoolSiC Trench MOSFETs with low inductive design for reduced switching losses
Includes built-in NTC temperature sensor for thermal monitoring
Utilizes PressFIT connection technology combined with integrated mounting clamps

Applications

Solar applications

Procurement Notes

Verify the exact ordering suffix against official Infineon documentation before procurement. Confirm that the specific variant matches the required electrical characteristics and package type. Ensure compatibility with existing gate drive requirements and thermal management systems. Check for any updated application notes regarding gate voltage windows.

Selection Notes

Select this component based on its 1200 V rating and 25 A continuous current capability. Consider the low inductive design for high-frequency switching efficiency. Evaluate the thermal resistance values for heatsink sizing. Verify that the operating temperature range meets the environmental requirements of the target system.

Part Context

This module belongs to the EasyPACK family designed for power electronics. It incorporates CoolSiC technology for improved performance over traditional silicon devices. The integration of NTC sensors allows for precise thermal management within the power module assembly.

Replacement Considerations

Consult official Infineon replacement guides for compatible modules. Verify pinout and mechanical dimensions match the existing design. Ensure electrical parameters such as voltage ratings and current capabilities are equivalent or superior.