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DG411DJ-E3 is listed in the Analog Switches, Multiplexers, Demultiplexers range at ChipApex. The manufacturer field lists Vishay Siliconix. Its product description is IC SWITCH SPST-NCX4 35OHM 16DIP. Review the specifications below when checking this part for your BOM.
The Vishay Siliconix DG411DJ-E3 is a monolithic quad single-pole single-throw (SPST) CMOS analog switch housed in a 16-pin PDIP package. It features a maximum on-resistance of 35 ohms and operates with a single supply voltage range of 13V to 44V or dual supplies of ±15V. The device exhibits a maximum turn-on time of 175ns and a turn-off time of 145ns, with a maximum power dissipation of 470mW. It supports a continuous DC switch current of 30mA and maintains an operating temperature range from -40°C to +85°C.
Verify the specific suffix 'DJ' confirms the 16-lead plastic DIP package configuration before procurement. Confirm RoHS compliance status via the manufacturer's latest documentation. Ensure the component meets the required thermal dissipation limits for the intended PCB layout. Check for any recent production change notices affecting pinout or material composition.
Select this component when high voltage signal switching up to 40V peak-to-peak is required. The 35 ohm on-resistance suits precision applications needing low signal error. Consider the PDIP package for through-hole prototyping or high-reliability mounting requirements. Verify logic polarity compatibility as the DG411 uses negative logic for switch activation.
The DG411 series serves as a drop-in replacement for the legacy DG211 and DG212 devices. It offers improved performance metrics including lower on-resistance and faster switching speeds compared to its predecessors. The series utilizes advanced high-voltage silicon-gate processing to enhance reliability and reduce charge injection effects in analog signal paths.
The DG412DJ-E3 is functionally identical but utilizes positive logic for switch selection. The DG413HSDY-E3 offers mixed logic configurations within the same package. Verify that alternative packages such as SOIC or TSSOP variants meet the mechanical constraints of the existing design.
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