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The DMC2700UDM-7 is a complementary pair enhancement mode MOSFET manufactured by Diodes Incorporated. It integrates one N-channel and one P-channel device in an SOT-26 package. The N-channel transistor (Q1) supports a drain-source voltage of 20V with a maximum continuous drain current of 1.34A at +25°C, while the P-channel transistor (Q2) handles -20V and -1.14A. Key electrical parameters include an on-resistance of 0.4Ω for Q1 and 0.7Ω for Q2 at VGS = 4.5V. The component operates within a temperature range of -55°C to +150°C and features low gate threshold voltage and fast switching characteristics.
Verify the specific ordering suffix matches the required packaging format. Confirm that the component version aligns with the intended application requirements. Check for automotive compliance if AEC-Q100/101 qualification is necessary, as standard versions may differ from automotive-compliant variants. Ensure sourcing channels are authorized to guarantee product authenticity and traceability.
Select this component for applications requiring a compact dual-transistor solution for low-voltage switching. Evaluate thermal performance based on the specified junction-to-ambient thermal resistance. Consider the gate charge values when designing driving circuits to ensure adequate switching speed. Verify that the operating voltage and current limits remain within the specified absolute maximum ratings under all expected conditions.
This part belongs to the DMC2700UDM family of complementary MOSFETs produced by Diodes Incorporated. It shares functional similarities with other low-voltage complementary pairs but is distinguished by its specific pinout and package dimensions. Related parts in the series may offer different current ratings or packaging options to suit various board space constraints.
Direct substitutes include the DMC2700UDM without the trailing number, which denotes the same device functionality. Other compatible alternatives may include the DMC2020USD series for similar voltage ratings. Verify pin compatibility and thermal characteristics before implementing any cross-brand replacements.