DPG30C300PB

Diode Arrays Overview

The IXYS DPG30C300PB is a dual fast recovery rectifier diode from the HiPerFRED2 series, housed in a TO-220AB-3 package. It features a 300 V peak repetitive reverse voltage and a continuous forward current of 30 A per leg. The device exhibits a typical reverse recovery time of 35 ns and a maximum surge current capability of 240 A. Forward voltage drop is specified at 1.51 V, with a low reverse leakage current of 1 uA. Power dissipation reaches 65 W, supporting operation between -55 C and +175 C junction temperature.

Diode Arrays Feature Summary

• Dual common cathode configuration for efficient bridge or push-pull circuit integration
• HiPerFRED2 technology enabling rapid 35 ns reverse recovery for high-frequency switching
• High thermal stability with extended junction temperature range up to +175 C

Diode Arrays Applications

• High-frequency DC-DC converters
• Resonant converter topologies
• Uninterruptible power supply (UPS) output stages

Diode Arrays Procurement Notes

Verify the specific suffix PB confirms the TO-220AB-3 through-hole package variant. Confirm RoHS compliance status via official datasheet as requirements vary by region. Check for moisture sensitivity classification prior to surface mount reflow processes if applicable to assembly lines. Ensure ordering quantities align with standard tube packaging configurations provided by the manufacturer.

Diode Arrays Selection Notes

Select this component when dual-diode symmetry is required within a single package footprint. The 30 A rating suits moderate power applications where space constraints limit discrete diode placement. Compare forward voltage characteristics against alternative brands to optimize conduction losses. Validate thermal management solutions to maintain junction temperatures within the specified +175 C limit during peak load conditions.

Diode Arrays Part Context

This part belongs to the IXYS HiPerFRED2 family, designed for hard-switching applications requiring fast recovery characteristics. The DPG30C300PB specifically addresses needs for compact dual-diode solutions in power electronics. It complements other series members like the DPG30C300HB which offers similar electrical performance but utilizes a different TO-247AD-3 package form factor for distinct mounting requirements.

Diode Arrays Replacement Considerations

Direct functional substitutes include the DPG30C300HB for identical electrical specs in a TO-247AD-3 package. The DPG30C300PC provides equivalent performance in a TO-263-4 surface-mount format. Verify pinout compatibility and thermal resistance differences before substituting across package types.