ChipApex | Global Electronic Components Supplier
SEARCH
Search Product
Search Post
— IC芯片 | 连接器 | 传感器 | 被动器件 —
Consult the customer manager about the wholesale price.
consultation hotline：86-132-6715-2157
email：[email protected]
Contact the product manager for consultation. One-stop consultation is available.
Do you want a lower wholesale price? Please send us your inquiry and we will reply immediately.
Product Detailed Parameters
- Description：EASY STANDARD
- Series：-
- Mfr：Infineon Technologies
- Package：Tray
- FET Type：-
- Technology：-
- Drain to Source Voltage (Vdss)：-
- Current - Continuous Drain (Id) @ 25°C：-
- Drive Voltage (Max Rds On, Min Rds On)：-
- Rds On (Max) @ Id, Vgs：-
- Vgs(th) (Max) @ Id：-
- Gate Charge (Qg) (Max) @ Vgs：-
- Vgs (Max)：-
- Input Capacitance (Ciss) (Max) @ Vds：-
- FET Feature：-
- Power Dissipation (Max)：-
- Operating Temperature：-
- Grade：-
- Qualification：-
- Mounting Type：-
- Supplier Device Package：-
- Package / Case：-
Download product information
Overview
The F433MR12W1M1HPB76BPSA1 is a hybrid intelligent power module from Infineon's EconoDUAL 3 series. It integrates three IGBT chips with SiC MOSFETs in a half-bridge configuration, rated for 1200V and 433A. The module utilizes press-fit technology for mechanical mounting and features an integrated temperature sensor. Designed for high-efficiency applications, it offers low switching losses and robust short-circuit capability within its specified operating conditions.
Feature Summary
- Integrates third-generation IGBT and silicon carbide MOSFET technologies for optimized switching performance
- Utilizes press-fit termination technology to eliminate solder joint fatigue and improve thermal cycling reliability
- Features an integrated NTC temperature sensor for precise junction temperature monitoring and protection
Applications
- Industrial motor drives and servo systems
- Uninterruptible power supplies (UPS)
- Solar inverters and wind turbine converters
Procurement Notes
Verify the specific suffix BPSA1 against the manufacturer's current datasheet to confirm pinout compatibility and terminal plating specifications. Ensure that the receiving facility has appropriate handling procedures for press-fit components, as standard soldering techniques are not applicable for installation. Cross-reference the lot code with Infineon's traceability records to validate manufacturing origin and quality certifications prior to integration into production lines.
Selection Notes
Select this module when high current density and reduced system volume are critical requirements. The combination of IGBT and SiC devices allows for higher switching frequencies compared to traditional IGBT-only modules. Engineers should evaluate the thermal resistance characteristics against their heatsink design to ensure junction temperatures remain within safe operating limits during peak load conditions.
Part Context
This component belongs to Infineon's EconoDUAL 3 family, which is widely adopted in medium-power industrial applications. The series is known for its standardized footprint and enhanced thermal performance. This specific variant represents a high-current solution designed to replace older discrete or smaller module architectures in demanding power conversion environments requiring high reliability.
Replacement Considerations
Direct replacements must match the 1200V/433A rating and EconoDUAL 3 footprint. Verify that alternative modules support press-fit mounting if board layout cannot be modified. Check gate threshold voltage compatibility with existing driver circuits to prevent malfunction during replacement scenarios.
