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The FBG04N30BC is a radiation-hardened enhancement-mode gallium nitride (GaN) high-electron-mobility transistor (HEMT) manufactured by EPC Space, LLC. It features a lateral die structure designed for high-reliability applications in space and power systems. Key electrical parameters include a drain-source voltage (VDS) of 40 V, a continuous drain current (ID) of 30 A at case temperature, and a maximum on-resistance (RDS(on)) of 11 mΩ. The device utilizes the FSMD-B surface-mount package.
Verify the specific ordering suffix and datasheet revision when sourcing this component. Confirm that the received part matches the exact radiation-hardened specification required for your mission profile. Contact EPC Space directly for official distribution channels and technical support regarding availability.
Select this component for applications requiring radiation tolerance and high-speed switching capabilities within a 40 V system. Ensure thermal management aligns with the 30 A case temperature rating. Consider the FSMD-B package constraints for PCB layout and verify compatibility with existing drive circuits due to the enhancement-mode characteristics.
This part belongs to EPC Space's portfolio of rad-hard GaN packaged HEMTs. It complements other devices like the FBG04N30BSH and EPC7001BC, targeting the niche market for high-reliability power solutions where standard commercial components would fail due to radiation exposure.
For P-channel replacements, contact [email protected] directly as no direct substitute is listed. Verify pinout and thermal requirements before considering any alternative manufacturers.