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Product Detailed Parameters
- Description：IGBT MOD 1700V 375A 1650W
- Series：EconoDUAL™ 3
- Mfr：Infineon Technologies
- Package：Bulk,Tray
- IGBT Type：Trench Field Stop
- Configuration：Half Bridge
- Vce(on) (Max) @ Vge, Ic：2.45V @ 15V, 300A
- Input：Standard
- NTC Thermistor：Yes
- Operating Temperature：-40°C ~ 125°C
- Mounting Type：Chassis Mount
- Package / Case：Module
- Supplier Device Package：Module
- Voltage - Collector Emitter Breakdown (Max)：1700 V
- Current - Collector (Ic) (Max)：375 A
- Power - Max：1650 W
- Current - Collector Cutoff (Max)：3 mA
- Input Capacitance (Cies) @ Vce：27 nF @ 25 V
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Overview
The FF300R17ME3BOSA1 is a Trenchstop IGBT3 half-bridge module rated at 1700 V and 300 A. It features an EconoDUAL 3 package with solder pin mounting. Key electrical parameters include a typical collector-emitter saturation voltage of 2 V at 25°C and a forward voltage of 1.8 V for the integrated anti-parallel diode. The device operates within a junction temperature range of -40°C to +150°C. It utilizes silicon technology and is designated as not recommended for new designs.
Feature Summary
- Integrates Trenchstop IGBT3 technology for optimized switching performance.
- Includes an integrated NTC thermistor for precise thermal monitoring.
- Features screw-mountable solder pins for reliable mechanical connection.
Applications
- Industrial motor drives
- Uninterruptible power supplies (UPS)
- Induction heating systems
Procurement Notes
Verify component authenticity through authorized channels due to the NRND status. Confirm that the specific BOSA1 suffix matches the required RoHS compliance and packaging specifications. Cross-reference the datasheet version to ensure compatibility with existing design documentation before procurement.
Selection Notes
Select this component when a 1700 V rating is required for high-voltage industrial applications. Ensure the system design accommodates the 300 A continuous current capability. Verify that the PCB layout supports the EconoDUAL 3 footprint and that the thermal management system handles the specified power dissipation limits effectively.
Part Context
This part belongs to Infineon's EconoDUAL 3 family, designed for compact power conversion. It succeeds earlier generations like the EconoPACK series. The Trenchstop IGBT3 technology represents a mature silicon platform balancing efficiency and ruggedness for medium-power industrial electronics.
Replacement Considerations
Consider the FF300R17ME4_B11 for updated PressFIT mounting options. Evaluate the FF300R17KE3 if higher current ratings are needed. Verify pinout compatibility and thermal characteristics before substituting any alternative modules in existing assemblies.
