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Product Detailed Parameters
- Description：IGBT MOD 3300V 450A AGXHP100-3
- Series：XHP™3
- Mfr：Infineon Technologies
- Package：Tray
- IGBT Type：Trench Field Stop
- Configuration：Half Bridge
- Vce(on) (Max) @ Vge, Ic：2.75V @ 15V, 450A
- Input：Standard
- NTC Thermistor：No
- Operating Temperature：-40°C ~ 150°C
- Mounting Type：Chassis Mount
- Package / Case：Module
- Supplier Device Package：AG-XHP100-3
- Voltage - Collector Emitter Breakdown (Max)：3300 V
- Current - Collector (Ic) (Max)：450 A
- Power - Max：1000000 W
- Current - Collector Cutoff (Max)：5 mA
- Input Capacitance (Cies) @ Vce：-
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Overview
The FF450R33T3E3P4BPMA1 is a high-voltage IGBT module from Infineon Technologies, belonging to the XHP HV series. It features a dual configuration with a maximum collector-emitter voltage (VCEO) of 3.3 kV and a continuous collector current (Ic) of 450 A at 25°C. The device utilizes silicon technology and operates within a junction temperature range of -40°C to +150°C. Key electrical parameters include a typical saturation voltage of 2.5 V and a maximum gate-emitter voltage of 20 V. The module is housed in the AG-XHP100-3 package and supports screw mounting for robust thermal management.
Feature Summary
- High power density design utilizing XHP HV packaging technology
- Dual IGBT configuration optimized for high-current applications
- Robust thermal performance with screw-mount installation capability
Applications
- High-power industrial motor drives
- Medium voltage traction systems
- Industrial inverter applications
Procurement Notes
Verify the complete part number including suffixes such as BPMA1 against official Infineon documentation to ensure correct variant identification. Confirm RoHS compliance status and specific datasheet revisions prior to ordering. Cross-reference manufacturer part numbers with distributor codes to prevent procurement errors due to naming variations or obsolete listings.
Selection Notes
Select this component for applications requiring 3.3 kV blocking capability and 450 A continuous current handling. Ensure the cooling system design accommodates the specified thermal characteristics of the AG-XHP100-3 package. Verify that the drive circuitry supports the required gate voltage limits and switching speeds associated with Trenchstop IGBT3 technology.
Part Context
This module is part of Infineon's XHP HV family, designed for high-power density requirements. It complements other high-voltage IGBT solutions by offering enhanced thermal performance and compact form factors suitable for demanding industrial and traction environments where reliability and efficiency are critical.
Replacement Considerations
Direct replacements may include FF450R33T3E3BPSA1, which shares similar electrical ratings and packaging. Verify pinout compatibility and thermal interface specifications before substitution. Consult official Infineon cross-reference guides for qualified alternative part numbers.
