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FF4MR20KM1HHPSA1 is listed in the FET, MOSFET Arrays range at ChipApex. The manufacturer field lists Infineon Technologies. Its product description is MOSFET 2N-CH 2000V AG-62MMHB. Review the specifications below when checking this part for your BOM.
The FF4MR20KM1HHPSA1 is a CoolSiC Trench MOSFET half-bridge module from the 62 mm C-Series. It features a 2000 V drain-source voltage and supports a continuous DC drain current of 280 A at 175 °C junction temperature, with a repetitive peak current of 600 A. The on-state resistance is typically 3.5 mΩ at 25 °C. The module provides 4 kV AC isolation for one minute and operates within a junction temperature range of -40 °C to 175 °C.
Verify the specific ordering suffix HHPSA1 against official Infineon documentation to confirm exact packaging and reel specifications. Ensure compatibility with recommended mounting torque values and thermal interface materials as defined in the application notes. Confirm that the component meets all relevant industrial qualification standards required for the target deployment environment.
Select this module for designs requiring high voltage blocking capability and efficient thermal management. Consider the 62 mm form factor for standard heatsink integration. Evaluate gate drive requirements based on the specified internal gate resistance and total gate charge parameters to optimize switching performance and minimize electromagnetic interference during operation.
This component belongs to the Infineon 62 mm C-Series, designed for compact power electronics. It integrates two N-channel SiC MOSFETs in a half-bridge configuration. The series emphasizes reliability and efficiency for demanding industrial environments, utilizing advanced trench gate technology to reduce conduction and switching energy losses compared to planar devices.
Consult official cross-reference lists for verified substitutes. Ensure any replacement maintains identical voltage ratings, current capabilities, and package dimensions to fit existing mechanical constraints without redesigning the PCB or cooling system.
The maximum operating junction temperature is 175 °C.
Yes, each MOSFET includes an integrated body diode with specified forward voltage and current ratings.
The module offers 4 kV AC isolation for one minute between terminals and the baseplate.
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