FGA30N60LSDTU

FGA30N60LSDTU

$2.47
  • Description:IGBT TRENCH FS 600V 60A TO-3P
  • Series:-

SKU:d2222e981bad Category: Brand:

  
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Product Detailed Parameters

  • Description:IGBT TRENCH FS 600V 60A TO-3P
  • Series:-
  • Mfr:Fairchild Semiconductor
  • Package:Bulk
  • IGBT Type:Trench Field Stop
  • Voltage - Collector Emitter Breakdown (Max):600 V
  • Current - Collector (Ic) (Max):60 A
  • Current - Collector Pulsed (Icm):90 A
  • Vce(on) (Max) @ Vge, Ic:1.4V @ 15V, 30A
  • Power - Max:480 W
  • Switching Energy:1.1mJ (on), 21mJ (off)
  • Input Type:Standard
  • Gate Charge:225 nC
  • Td (on/off) @ 25°C:18ns/250ns
  • Test Condition:400V, 30A, 6.8Ohm, 15V
  • Reverse Recovery Time (trr):35 ns
  • Operating Temperature:-55°C ~ 150°C (TJ)
  • Mounting Type:Through Hole
  • Package / Case:TO-3P-3, SC-65-3
  • Supplier Device Package:TO-3P
  • Grade:-
  • Qualification:-

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FGA30N60LSDTU

Overview

The FGA30N60LSDTU is a Fairchild Semiconductor N-channel Insulated Gate Bipolar Transistor (IGBT) designed for high-power switching applications. It features a maximum collector-emitter voltage of 600 V and a continuous collector current rating of 30 A at case temperature. The device utilizes a TO-3PN through-hole package, providing robust thermal management capabilities with a maximum power dissipation of 150 W. It operates within a junction temperature range from -55 °C to +150 °C and supports a maximum gate-emitter voltage of ±20 V.

Feature Summary

  • High-speed switching capability suitable for inverter circuits
  • Low saturation voltage for improved conduction efficiency
  • Robust TO-3PN flange mount package for effective heat dissipation

Applications

  • AC and DC motor control systems
  • General purpose inverters
  • Robotics and servo controls

Procurement Notes

Verify the manufacturer part number against official Fairchild or onsemi datasheets to confirm pinout compatibility and electrical ratings. Ensure the procurement source provides authentic components with traceable documentation. Check for specific suffix variations that may indicate different packaging or testing standards. Confirm RoHS compliance status if required by the target assembly process.

Selection Notes

Select this component for designs requiring 600 V blocking capability and moderate current handling up to 30 A. The TO-3PN package necessitates adequate heatsinking infrastructure due to its flange-mount configuration. Evaluate thermal resistance parameters against the system's ambient conditions to ensure the junction temperature remains within the specified operational limits during peak load scenarios.

Part Context

This IGBT belongs to the Fairchild semiconductor lineup of insulated gate bipolar transistors, which are engineered for efficient power conversion. The TO-3PN form factor is standard for medium-to-high power discrete modules, allowing direct mounting to chassis or heatsinks. These devices bridge the gap between MOSFET speed and BJT current handling, serving as core switching elements in industrial power electronics.

Replacement Considerations

Direct replacements include the FGH30N60SFD and FGH40N60SFD from the same manufacturer family. Verify that substitute parts match the TO-3PN footprint and maintain equivalent Vces and Ic ratings. Cross-reference thermal characteristics and switching speeds to ensure circuit stability without redesigning the gate drive network.

FGA30N60LSDTUFGA30N60LSDTU
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