FS100R17KS4F

Overview

The FS100R17KS4F is a high-performance IGBT module manufactured by Infineon Technologies, designed for demanding power conversion applications. It features a 6-pack configuration with a collector-emitter maximum voltage of 1700V and a continuous collector current rating of 100A at 25°C. The device utilizes the EconoPACK3 package to ensure compact integration and efficient thermal management. Key electrical characteristics include a fast IGBT2 technology combined with Silicon Carbide (SiC) diodes, enabling superior switching performance. The module supports a maximum junction temperature of 175°C and operates within a standard industrial temperature range from -40°C to +150°C.

Feature Summary

• Integrates fast IGBT2 technology with high-speed SiC diodes for enhanced switching efficiency
• Utilizes the compact EconoPACK3 package design for reliable thermal management
• Provides robust 1700V blocking capability suitable for high-voltage industrial systems

Applications

• High-frequency industrial motor drives
• Medium voltage variable frequency drives
• Industrial power supply units requiring high reliability

Procurement Notes

Verify component authenticity through authorized Infineon distributors or certified partners. Confirm that the specific ordering suffix matches the required technical specifications, as variations may exist within the product family. Request official datasheets and test reports to validate performance parameters against application requirements before finalizing procurement decisions.

Selection Notes

Select this module when designing systems requiring high voltage isolation and rapid switching speeds. The combination of IGBT2 and SiC diodes offers lower switching losses compared to standard silicon solutions. Ensure the cooling system can handle the thermal dissipation capabilities of the EconoPACK3 form factor while maintaining the specified operating temperature limits for long-term reliability.

Part Context

This component belongs to Infineon's EconoPACK3 series, which focuses on providing high power density in a small footprint. The FS100R17KS4F specifically targets applications where space constraints and thermal efficiency are critical. It represents an evolution in hybrid modules, combining traditional IGBT robustness with the speed advantages of wide-bandgap semiconductor materials.

Replacement Considerations

Consult official Infineon documentation for direct cross-references. Potential alternatives within the same series should be evaluated based on matching voltage ratings, current capacity, and package dimensions to ensure mechanical and electrical compatibility without redesigning the host system.