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The FS600R07A2E3B32BOSA1 is a HybridPACK 2 IGBT module manufactured by Infineon Technologies. It utilizes silicon technology and features a six-pack configuration with integrated diodes. The device supports a maximum collector-emitter voltage of 650 V and delivers a continuous collector current of 600 A at 25°C. Key electrical parameters include a saturation voltage of 1.4 V, a gate-emitter leakage current of 400 nA, and a power dissipation rating of 1.55 kW. The module operates within a temperature range of -40°C to +150°C and employs through-hole mounting in a tray package.
This component is officially designated as End-of-Life (EOL) by the manufacturer. Availability is restricted, and distributors may not stock this specific part number. Engineers should verify current supply status carefully before finalizing designs. Procurement requires checking authorized channels for remaining inventory or transition plans to alternative components.
Selection requires evaluating thermal interface materials compatible with direct liquid cooling systems. The 650 V rating suits medium-voltage traction applications. Designers must account for the 1.55 kW power dissipation limit under expected operating conditions. Verify that the PCB layout supports the required current handling and mechanical stress for the HybridPACK 2 form factor.
This module belongs to Infineon's HybridPACK 2 family, designed specifically for automotive traction inverters. It represents a shift towards higher power density solutions compared to previous generations. The series integrates advanced cooling structures to support the demanding thermal cycles of electric vehicle powertrains.
The FS820R08A6P2BBPSA1 is listed as a potential replacement option. This alternative belongs to the HybridPACK Drive series and utilizes EDT2 technology. Verification of pinout compatibility and thermal performance is necessary before substitution.