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FSTD3306L8X is listed in the Signal Switches, Multiplexers, Decoders range at ChipApex. The manufacturer field lists Fairchild Semiconductor. Its product description is IC BUS SWITCH 1 X 1:1 8MICROPAK. Review the specifications below when checking this part for your BOM.
The FSTD3306L8X is a low-power bus switch manufactured by Fairchild Semiconductor, housed in an 8-lead TSSOP package. It functions as a bidirectional level-shifting device designed for high-speed data transmission applications. The component supports dual supply voltage ranges of 2.3V to 2.7V and 3V to 3.6V, enabling compatibility with various logic families. Operating reliably within a temperature range of -40°C to 85°C, it provides efficient signal routing while minimizing power consumption in portable electronic systems.
Verify the manufacturer origin carefully, as Fairchild Semiconductor operations have transitioned to onsemi. Confirm that the specific batch corresponds to the original Fairchild production specifications rather than subsequent onsemi manufacturing changes. Ensure the component meets RoHS3 compliance requirements if mandated by your regional regulations or project specifications before finalizing procurement orders.
Select this component when designing circuits that require bidirectional level shifting between 1.8V and 3.3V logic domains. It is appropriate for applications demanding low quiescent current and compact surface-mount packaging. Consider the 8-TSSOP form factor for space-constrained layouts. Ensure the operating voltage aligns with the specified 2.3V–2.7V and 3V–3.6V ranges for optimal performance.
This part belongs to the FST3306 series of low-power bus switches. It shares functional similarities with other members like the FSTD3306L8X variants but is distinguished by its specific pinout and packaging configuration. The series is designed to replace older discrete level-shifting solutions, offering integrated protection and switching in a single small outline package.
The PI3VT3306LEX from Diodes Incorporated serves as a direct functional substitute. Both components offer identical 1x1:1 bus switching functionality in an 8-TSSOP package with compatible voltage ranges. Verify pin-to-pin compatibility and thermal characteristics during integration.
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