SEARCH
— IC芯片 | 连接器 | 传感器 | 被动器件 —
The Greenlee Communications HE.10281 is a release pin component designed for use with cable termination tools, specifically dieless crimping systems. This part functions as a mechanical release mechanism to facilitate the ejection of dies or punches from tool heads during maintenance or operation. It is classified under cable termination accessories and is manufactured by Greenlee Textron, Inc.
Verify compatibility with specific Greenlee dieless crimping tool models before purchase. Confirm that the part number HE.10281 matches the required release pin specification for your equipment. Check manufacturer documentation for any updates regarding tool compatibility or replacement procedures.
Select this part only if it is specified as the correct release pin for your existing Greenlee dieless crimping tool. Ensure the tool model requires this specific pin type for proper function. Do not substitute with generic pins unless explicitly verified by the manufacturer.
This component belongs to the category of cable termination accessories, specifically within the dieless crimping tool segment. It is a small but critical mechanical part that ensures smooth operation and maintenance of professional-grade crimping tools used in telecommunications and electrical installations.

Monolithic Power Systems (MPS), a global leader in analog and mixed-signal semiconductors, has notified its distribution partners of an upcoming price increase for selected…
Read More
STMicroelectronics (ST), a global leader in semiconductor manufacturing, has officially notified customers of a new round of price increases for selected products, set to…
Read More
In an era dominated by AI accelerators with terabytes of HBM memory and consumer devices racing toward LPDDR5X bandwidth, it’s easy to wonder: why…
Read More
The global electronics industry is facing an escalating shortage of tantalum capacitors, a critical passive component, as surging demand from AI servers, automotive electronics,…
Read More
TOKYO, April 1, 2026 – Kioxia Corporation (formerly Toshiba Memory Corporation), a global leader in flash memory and storage solutions, has officially issued a…
Read MoreLas Vegas, January 6, 2026 — At the Consumer Electronics Show (CES) 2026, Texas Instruments (TI) (NASDAQ: TXN) announced a suite of next-generation semiconductor…
Read More
Understand thermal fuse operation, Tf, Th and Tm, electrical ratings and mounting. Check temperature limits and replacement requirements for your design.
Read More
PLANO, Texas – March 20, 2026 – Diodes Incorporated (Nasdaq: DIOD), a leading global manufacturer and supplier of high-quality application-specific standard products in the…
Read More
Learn what a battery BMS does, how protection differs from charging, and which pack specifications to check when sourcing BMS components through ChipApex.
Read More
TOKYO, April 15, 2026 – Taiyo Yuden Co., Ltd. (TAIYO YUDEN), a leading global manufacturer of passive electronic components, has officially notified its worldwide…
Read More
Recently, the global electronic component market has witnessed a series of new developments. The strategic layouts and market collaborations of major enterprises are constantly…
Read More-768x745.jpg)
CHICAGO, USA – May 27, 2026 – Global leading interconnect manufacturer Molex officially issued a global distributor price adjustment notice on May 27, confirming…
Read More