HHM1903A4

$0.15

Description：BALUN 2.4GHZ-2.5GHZ 50/100 0402
Series：HHM
Mfr：TDK Corporation
Package：Tape & Reel (TR),Cut Tape (CT)

SKU:84a8579192b7 Category: Balun Brand: TDK Corporation

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Product introduction

HHM1903A4 is listed in the Balun range at ChipApex. The manufacturer field lists TDK Corporation. Its product description is BALUN 2.4GHZ-2.5GHZ 50/100 0402. Review the specifications below when checking this part for your BOM.

Balun specifications for HHM1903A4

Description：BALUN 2.4GHZ-2.5GHZ 50/100 0402
Series：HHM
Mfr：TDK Corporation
Package：Tape & Reel (TR),Cut Tape (CT)
Frequency Range：2.4GHz ~ 2.5GHz
Impedance - Unbalanced/Balanced：50 / 100Ohm
Phase Difference：180° ±10°
Insertion Loss (Max)：0.55dB
Return Loss (Min)：10dB
Package / Case：0402 (1005 Metric)
Mounting Type：Surface Mount

Balun datasheet and documents for HHM1903A4

HHM1903A4

Balun Overview

The HHM1903A4 is a surface-mount LTCC balun designed for RF signal conditioning. It operates within the 2.4 GHz to 2.5 GHz frequency range with a bandwidth of 400 MHz. The component provides impedance transformation between a 50 Ohm unbalanced port and a 100 Ohm balanced port. It supports a minimum operating temperature of -40°C and a maximum of +85°C. The device utilizes an SMD/SMT termination type and is available in a 0402 (1005 Metric) package format.

Balun Feature Summary

Integrates low-temperature co-fired ceramic (LTCC) technology for compact RF balancing
Facilitates impedance matching between 50 Ohm and 100 Ohm transmission lines
Optimized for high-frequency signal integrity in wireless applications

Balun Applications

Wireless LAN modules
Bluetooth transceivers
Zigbee communication devices

Balun Procurement Notes

Verify that the specific part number matches the required impedance configuration and frequency band. Confirm package dimensions align with PCB footprint requirements. Ensure environmental ratings meet operational temperature constraints. Cross-reference manufacturer documentation for accurate handling and soldering guidelines.

Balun Selection Notes

Select this component when a compact solution is needed for balancing signals in the 2.4 GHz ISM band. Consider the 0402 package size for space-constrained designs. Evaluate insertion loss and return loss specifications against system performance requirements. Ensure compatibility with standard surface-mount assembly processes.

Balun Part Context

This balun belongs to TDK's HHM series of RF components. These devices are engineered for high-performance signal processing in mobile and wireless infrastructure. The series offers various impedance configurations and frequency ranges to support diverse communication standards.

Balun Replacement Considerations

Consult official substitution lists for compatible baluns with identical 50/100 Ohm impedance ratios and 2.4-2.5 GHz coverage. Verify package compatibility before replacement.

Explore related parts through RF and Wireless, all product categories, ChipApex homepage.

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