IDT72V73260BB

IDT72V73260BB

  • Description:IC MULTIPLEXER 1 X 32:32 144PBGA
  • Series:72V
  • Mfr:Renesas Electronics Corporation
  • Package:Tray

SKU:22a4e11c8558 Category: Brand:

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Product Detailed Parameters

  • Description:IC MULTIPLEXER 1 X 32:32 144PBGA
  • Series:72V
  • Mfr:Renesas Electronics Corporation
  • Package:Tray
  • Type:Multiplexer
  • Circuit:1 x 32:32
  • Independent Circuits:1
  • Current - Output High, Low:-
  • Voltage Supply Source:Single Supply
  • Voltage - Supply:3V ~ 3.6V
  • Operating Temperature:-40°C ~ 85°C
  • Mounting Type:Surface Mount
  • Package / Case:144-BGA
  • Supplier Device Package:144-PBGA (13x13)
  • Grade:-
  • Qualification:-

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IDT72V73260BB

Overview

The IDT72V73260BB is a high-performance digital bus switch IC manufactured by Renesas Electronics. It features a 16K x 16K switching matrix architecture, designed for complex signal routing applications. The device operates within a single 3.3V power supply range and utilizes a TQFP-144 package. This component belongs to the 72V73260 series and serves as a direct equivalent to the IDT72V73260DAG variant, providing robust connectivity for system-level interconnects.

Feature Summary

  • Implements a 16K x 16K digital bus switching matrix for flexible signal routing
  • Operates on a single 3.3V power supply for simplified integration
  • Housed in a TQFP-144 surface-mount package for compact board layouts

Applications

  • Complex digital bus switching systems
  • Signal routing in telecommunications infrastructure
  • Data communication network interfaces

Procurement Notes

Verify current availability status as this component may be subject to discontinuation notices. Confirm that the BB suffix corresponds to the specific package and temperature grade required for your design. Ensure moisture sensitivity level requirements are met during storage and handling procedures.

Selection Notes

Select this part when a 16K x 16K switching capacity is required within a 3.3V logic environment. Compare against the DAG variant to ensure package compatibility matches your PCB footprint constraints. Validate that the TQFP-144 form factor fits within the thermal and spatial limits of the target assembly.

Part Context

This component is part of the 72V73260 family of digital bus switches. It shares architectural similarities with other members like the 72V73250BB but offers distinct density characteristics. The product line focuses on providing scalable interconnect solutions for high-density electronic systems requiring reliable signal path management.

Replacement Considerations

The IDT72V73260DAG is a confirmed substitute part number for this component. Verify pinout and electrical specifications match before implementation.

IDT72V73260BBIDT72V73260BB

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