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Product Detailed Parameters
- Description：IGBT TRENCH FIELD STOP 1200V DIE
- Series：TrenchStop™
- Mfr：Infineon Technologies
- Package：Bulk
- IGBT Type：Trench Field Stop
- Voltage - Collector Emitter Breakdown (Max)：1200 V
- Current - Collector (Ic) (Max)：-
- Current - Collector Pulsed (Icm)：24 A
- Vce(on) (Max) @ Vge, Ic：2.07V @ 15V, 8A
- Power - Max：-
- Switching Energy：-
- Input Type：Standard
- Gate Charge：-
- Td (on/off) @ 25°C：-
- Test Condition：-
- Reverse Recovery Time (trr)：-
- Operating Temperature：-40°C ~ 175°C (TJ)
- Mounting Type：Surface Mount
- Package / Case：Die
- Supplier Device Package：Die
- Grade：-
- Qualification：-
Download product information
Overview
The IGC11T120T8LX1SA1 is a single IGBT die from Infineon Technologies, utilizing Trench Field Stop technology. It features a 1200 V drain-source breakdown voltage and operates within a junction temperature range of -40°C to 175°C. The component is designed for surface mount installation in a BGA package configuration. This power transistor supports standard input types and is optimized for high-efficiency power control applications requiring robust switching performance.
Feature Summary
- Utilizes Trench Field Stop technology for enhanced switching efficiency
- Designed for surface mount integration in compact layouts
- Supports high-temperature operation up to 175°C junction temperature
Applications
- Power control systems
- Automotive electronics
- Industrial motor drives
Procurement Notes
Verify the current lifecycle status before procurement, as availability may vary across distributors. Confirm that the BGA package type aligns with your PCB footprint requirements. Ensure thermal management solutions accommodate the specified 175°C maximum junction temperature. Cross-reference the datasheet for precise electrical characteristics relevant to your specific circuit design constraints.
Selection Notes
Select this component when a 1200 V rated single IGBT die is required for surface mount applications. Consider the Trench Field Stop technology benefits for efficiency needs. Evaluate the BGA package compatibility against existing board designs. Assess thermal dissipation capabilities to ensure reliable operation within the -40°C to 175°C operating range for your specific environment.
Part Context
This part belongs to Infineon's IGBT portfolio, specifically focusing on trench field stop technology. It represents a discrete power semiconductor solution intended for integration into larger power modules or direct mounting. The product line targets applications demanding high voltage handling and efficient switching in automotive and industrial sectors.
Replacement Considerations
No public confirmed substitute part numbers are available in the provided documentation. Verify compatibility with alternative components based on matching voltage ratings, current capabilities, and package dimensions.
