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IL2 is listed in the Transistor, Photovoltaic Output Optoisolators range at ChipApex. The manufacturer field lists Vishay Semiconductor Opto Division. Its product description is OPTOISO 5.3KV TRANS W/BASE 6-DIP. Review the specifications below when checking this part for your BOM.
The IL2 is an optically coupled isolated pair manufactured by Vishay Semiconductor Opto Division, featuring a GaAs infrared LED and a silicon NPN phototransistor with base output. It provides 5300Vrms isolation voltage across one channel in a 6-DIP package. The device supports a maximum DC forward current of 60 mA with a typical forward voltage of 1.3V. Output characteristics include a maximum collector-emitter voltage of 30V and a saturation voltage of 400mV. It operates within a temperature range of -55°C to 100°C and complies with RoHS3 standards.
Verify the specific ordering suffix to ensure the correct packaging format, such as tube or tape and reel, matches your assembly requirements. Confirm that the component meets the required RoHS3 compliance status for your region. Cross-reference the datasheet version to ensure no recent design changes affect pinout or electrical parameters before finalizing procurement.
Select the IL2 when high isolation voltage up to 5300Vrms is required alongside a transistor output with base access. Consider the 6-DIP package constraints for through-hole mounting. Evaluate the 30V output voltage limit against your circuit needs. Ensure the operating temperature range of -55°C to 100°C aligns with your environmental conditions.
The IL2 belongs to Vishay's family of optocouplers designed for general-purpose isolation applications. It shares architectural similarities with other devices in the series but is distinguished by its specific 5300Vrms rating and 6-DIP form factor. This model serves as a foundational component for circuits requiring reliable galvanic separation between low-voltage control logic and higher-voltage power stages.
Consult official substitution lists for direct replacements. Verify compatibility regarding isolation voltage, pin configuration, and package dimensions before swapping components.
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