IPL1-114-02-L-S-K

Headers, Male Pins Overview

The IPL1-114-02-L-S-K is a Mini Mate® header connector manufactured by Samtec Inc. It features a 2.54 mm (0.100 inch) pitch with 14 positions in a single row. Designed for surface mount installation, it utilizes phosphor bronze contacts with gold plating and an LCP insulator. The component supports a voltage rating of 275 VAC and operates within a temperature range of -55°C to 125°C.

Headers, Male Pins Feature Summary

• Surface mount termination style for automated PCB assembly
• Gold-plated phosphor bronze contacts for reliable signal transmission
• LCP insulation material providing high thermal stability

Headers, Male Pins Applications

• Wire-to-board interconnections
• Discrete wire cable assemblies
• General electronic circuit board connections

Headers, Male Pins Procurement Notes

Verify the specific suffix codes against official documentation to ensure correct lead style and polarization options. Confirm RoHS compliance status and packaging format requirements prior to ordering. Cross-reference the manufacturer part number with authorized distributor catalogs to validate authenticity and current production status.

Headers, Male Pins Selection Notes

Select this component when a single-row surface mount header with a 2.54 mm pitch is required. Ensure the mating connector matches the specified contact gender and dimensions. Consider the operating temperature range and voltage ratings relative to the application environment before finalizing the design choice.

Headers, Male Pins Part Context

This part belongs to the Mini Mate® IPL1 series, which provides isolated power terminal headers. The series offers various configurations including keyed and shrouded options to enhance connection security. It is designed for applications requiring robust performance in compact spaces.

Headers, Male Pins Replacement Considerations

WORLDPO WIPL214P02LK is documented as a compatible substitute for similar IPL1 models. Verify mechanical compatibility and electrical specifications before implementing any alternative components.