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IRF7341TR is listed in the FET, MOSFET Arrays range at ChipApex. The manufacturer field lists UMW. Its product description is MOSFET 2N-CH 55V 4.7A 8SOP. Review the specifications below when checking this part for your BOM.
The IRF7341TR is a dual N-channel power MOSFET from UMW, utilizing Generation V HEXFET technology in an SOP-8 package. It features ultra-low on-resistance and fast switching capabilities. Key electrical parameters include a drain-source voltage of 55V, continuous drain current of 4.7A at 25°C case temperature, and maximum gate-source voltage of ±20V. The device exhibits a typical total gate charge of 24nC at 10V and a junction-to-ambient thermal resistance of 62.5°C/W. It supports a junction temperature range from -55°C to +150°C.
Verify the component authenticity by checking the marking code against the official datasheet specifications. Confirm the package type is SOP-8 and the delivery mode matches the ordered quantity requirements. Ensure the supplier provides valid documentation supporting the Generation V technology claims. Cross-reference the part number suffix TR with tape and reel packaging details.
Select this component when designing circuits requiring dual N-channel MOSFETs in a compact form factor. Consider the 55V breakdown voltage and 4.7A continuous current limits for load matching. Evaluate the thermal resistance of 62.5°C/W for heat dissipation needs. Check the gate threshold voltage minimum of 1.0V for compatibility with logic-level drivers.
This part belongs to the HEXFET family of power MOSFETs known for advanced processing techniques. It is manufactured by UMW (UTD Semiconductor Co., Limited) as indicated in the provided datasheet. The IRF7341 series is designed for surface mount applications, offering improved thermal characteristics through customized leadframes compared to standard packages.
Direct substitutes may include other dual N-channel MOSFETs with similar 55V ratings and SOP-8 packaging. Verify pinout compatibility and thermal resistance values before substitution. Ensure the replacement device meets or exceeds the required on-resistance and switching speed specifications for the specific application circuit.
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