SEARCH
— IC芯片 | 连接器 | 传感器 | 被动器件 —
The IRGPC30FD2 is a co-packaged Insulated Gate Bipolar Transistor (IGBT) with an ultrafast soft recovery diode in a TO-247AC package. It features a collector-to-emitter voltage of 600V and continuous collector current ratings of 31A at 25°C case temperature and 17A at 100°C. The device includes a fast co-packaged diode with a maximum forward current of 120A. Thermal resistance from junction to case is 1.2°C/W for the IGBT and 2.5°C/W for the diode. Operating junction temperature ranges from -55°C to +150°C.
Verify the specific datasheet version and manufacturer documentation when sourcing this component, as specifications may vary by revision. Confirm that the TO-247AC package dimensions match your board layout requirements. Ensure thermal management solutions account for the specified junction-to-case thermal resistance values under expected operating conditions.
Select this component for applications requiring high-voltage switching with integrated freewheeling capabilities. Consider the 600V rating and current handling capacity relative to system load requirements. Evaluate the thermal performance characteristics against your cooling strategy, particularly for operation near the upper temperature limits.
This part belongs to Infineon's Fast CoPack IGBT line, extending their established IGBT portfolio. It combines an n-channel IGBT with a co-packaged diode to simplify circuit design. The product targets high-power applications where space efficiency and switching performance are critical.
Check for direct replacements within the same Fast CoPack family or similar TO-247AC packages with matching voltage and current ratings. Verify pinout compatibility and thermal characteristics before substituting.