Memory IC IS61LV6416-10TLI-TR product image

IS61LV6416-10TLI-TR

  • Description:IC SRAM 1MBIT PARALLEL 44TSOP II
  • Series:-
  • Mfr:ISSI, Integrated Silicon Solution Inc
  • Package:Tape & Reel (TR)

SKU:c2d68285b827 Category: Brand:

ChipApex WhatsApp

Consult the customer manager about the wholesale price.

consultation hotline:86-132-6715-2157

email:[email protected]
Contact the product manager for consultation. One-stop consultation is available.


Do you want a lower wholesale price? Please send us your inquiry and we will reply immediately.

Submitting!
Submission successful!
Submission failed!
Email error!
Phone number error!

IS61LV6416-10TLI-TR is listed in the Memory IC range at ChipApex. The manufacturer field lists ISSI, Integrated Silicon Solution Inc. Its product description is IC SRAM 1MBIT PARALLEL 44TSOP II. Review the specifications below when checking this part for your BOM.

Memory IC specifications for IS61LV6416-10TLI-TR

  • Description:IC SRAM 1MBIT PARALLEL 44TSOP II
  • Series:-
  • Mfr:ISSI, Integrated Silicon Solution Inc
  • Package:Tape & Reel (TR)
  • Memory Type:Volatile
  • Memory Format:SRAM
  • Technology:SRAM - Asynchronous
  • Memory Size:1Mbit
  • Memory Organization:64K x 16
  • Memory Interface:Parallel
  • Clock Frequency:-
  • Write Cycle Time - Word, Page:10ns
  • Voltage - Supply:3.135V ~ 3.6V
  • Operating Temperature:-40°C ~ 85°C (TA)
  • Mounting Type:Surface Mount
  • Package / Case:44-TSOP (0.400", 10.16mm Width)
  • Supplier Device Package:44-TSOP II
  • Access Time:10 ns

Memory IC datasheet and documents for IS61LV6416-10TLI-TR

IS61LV6416-10TLI-TR

Memory IC Overview

The IS61LV6416-10TLI-TR is a high-speed, 1-Mbit static RAM organized as 65,536 words by 16 bits. It features a 10 ns access time and operates on a single 3.3V power supply with typical operating current of 75 mA and standby current of 0.5 mA. The device utilizes TTL-compatible interface levels and fully static operation without clock or refresh requirements. It includes three-state outputs and independent upper and lower byte data control. The component is housed in a 44-pin TSOP-II package and supports an industrial temperature range from -40°C to +85°C.

Memory IC Feature Summary

  • Supports fully static operation requiring no clock or refresh cycles
  • Provides independent upper and lower byte data control via UB and LB pins
  • Features low power consumption with dedicated CMOS standby mode
  • Utilizes TTL-compatible interface levels for simplified system integration

Memory IC Applications

  • High-speed cache memory systems
  • Buffer storage in telecommunications equipment
  • Industrial control logic applications
  • Portable electronic devices requiring low-power retention

Memory IC Procurement Notes

Verify the specific ordering suffix against the manufacturer's official documentation to confirm the exact package type, speed grade, and temperature rating. Ensure that the lead-free designation matches the project requirements. Confirm compatibility with existing PCB footprints for the 44-pin TSOP-II configuration before finalizing procurement orders.

Memory IC Selection Notes

Select this component when a 16-bit wide memory interface is required alongside low power consumption characteristics. The industrial temperature range makes it suitable for harsh environments. Verify that the 3.3V supply voltage aligns with the target system architecture and that the 10 ns access time meets the timing constraints of the host processor.

Memory IC Part Context

This part belongs to the IS61LV6416 family of high-speed CMOS static random-access memories. The series offers various speed grades and packaging options to accommodate different design needs. The 'L' variant indicates enhanced low-power performance compared to standard versions within the same organizational structure.

Memory IC FAQ

How does the device handle byte-level data access?

The device provides independent control over the upper and lower bytes using the UB (Upper Byte) and LB (Lower Byte) input pins, allowing selective reading or writing of either byte.

What is the mechanism for reducing power consumption during idle periods?

When the Chip Enable (CE) pin is deasserted, the device enters a standby mode. Utilizing CMOS input levels further reduces the standby current to a typical value of 0.5 mA.

IS61LV6416-10TLI-TRIS61LV6416-10TLI-TR

Click on the inquiry

Recent News