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IXFR80N20Q is listed in the Single FETs, MOSFETs range at ChipApex. The manufacturer field lists IXYS. Its product description is MOSFET N-CH 200V 71A ISOPLUS247. Review the specifications below when checking this part for your BOM.
The IXFR80N20Q is an N-channel enhancement mode power MOSFET from the IXYS HiPerFET family. It features a drain-source voltage (Vds) of 200 V and a continuous drain current (Id) of 80 A. The device utilizes a Direct-Copper-Bond substrate for high power dissipation capabilities. Key electrical parameters include a maximum on-state resistance (Rds(on)) of 28 mΩ, a gate charge (Qg) of 67 nC at 10 V, and a maximum power dissipation (Pd) of 690 W. It operates within a temperature range of -55°C to +150°C.
Verify the specific datasheet version and package tolerance against the manufacturer's official documentation before integration. Confirm that the thermal management design accommodates the specified power dissipation limits under actual operating conditions. Ensure compatibility with the intended gate drive voltage levels to maintain optimal switching performance and prevent overstress.
Select this component when designing circuits requiring high current handling at 200 V with low conduction losses. The integrated diode and ruggedness make it suitable for topologies demanding high dv/dt performance. Evaluate the thermal resistance requirements carefully to ensure the heat sinking solution supports the 690 W dissipation rating effectively in the target application environment.
This part belongs to the HiPerFET Q3-Class series, which offers reduced on-state resistance and gate charge compared to previous generations. The ISOPLUS247 package provides isolated mounting options, facilitating easier integration into high-voltage systems without additional insulation barriers while maintaining robust mechanical stability.
Cross-reference with IXFH80N20Q for similar specifications in standard TO-247 packages if isolation is not required. Verify pinout compatibility and thermal interface dimensions before substituting to ensure proper fit and function within the existing PCB layout and heatsink assembly.
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