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M22-5300205R is listed in the Headers, Male Pins range at ChipApex. The manufacturer field lists Harwin Inc.. Its product description is CONN HEADER SMD 4POS 2MM. Review the specifications below when checking this part for your BOM.
The M22-5300205R is a surface mount pin header manufactured by Harwin Inc. within the M22 series. It features a single row of four male pins with a 2.00mm pitch. The connector utilizes a double inline (DIL) design equipped with positioning pegs to ensure accurate alignment during automated assembly processes. This component is designed for direct soldering onto printed circuit boards, providing reliable electrical interconnection in compact electronic assemblies.
Verify the specific suffix 'R' against the manufacturer's official documentation to confirm reel packaging and RoHS compliance status. Ensure the ordering part number matches the exact pin count and pitch specifications required for your design. Cross-reference the datasheet for precise reflow soldering profile recommendations to maintain connection integrity.
Select this component when surface mount assembly is required for a four-position connection. The integrated pegs facilitate precise placement during pick-and-place operations. Verify that the PCB footprint accommodates the DIL body dimensions and that the soldering process aligns with the thermal requirements of the nickel barrier plating.
This part belongs to the Harwin M22 series, which focuses on high-density interconnect solutions. The series offers various mounting options including through-hole and surface mount variants. The M22-5300205R specifically addresses the need for reliable SMT headers in modern electronics manufacturing where space efficiency and assembly accuracy are critical priorities.
Direct substitutes must match the 4-pin count, 2.00mm pitch, and SMT mounting style. Verify compatibility of the positioning peg design with existing PCB tooling. Check if alternative manufacturers offer equivalent DIL headers with similar mechanical retention features.
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