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MBR50030CTR is listed in the Diode Arrays range at ChipApex. The manufacturer field lists GeneSiC Semiconductor. Its product description is DIODE MOD SCHOTT 30V 250A 2TOWER. Review the specifications below when checking this part for your BOM.
The GeneSiC Semiconductor MBR50030CTR is a silicon power Schottky diode module featuring a Twin Tower package. It provides a repetitive peak reverse voltage of 30 V and an average forward current rating of 500 A per package. The device exhibits a maximum forward voltage of 0.75 V per leg and a thermal resistance junction-to-case of 0.30 °C/W per leg. It supports an operating temperature range from -55 °C to 150 °C.
Verify the specific part number suffix against official documentation, as variations may exist between CT and CTR configurations. Confirm that the component meets required RoHS compliance standards before integration. Ensure the supplier provides valid traceability data and authentic manufacturer markings to guarantee component integrity and reliability in final assembly.
Select this component when a 30 V blocking voltage and 500 A continuous current capacity are required. The low forward voltage drop contributes to reduced conduction losses. The Twin Tower package facilitates direct screw mounting to heatsinks. Verify that the thermal management system can maintain the junction temperature within the specified -55 °C to 150 °C operational range during high-load scenarios.
This module belongs to the MBR500 series of silicon power Schottky rectifiers manufactured by GeneSiC Semiconductor. The series encompasses various voltage ratings from 20 V to 40 V, all sharing the same 500 A current rating and Twin Tower mechanical form factor. This standardization allows for flexible design scaling across different voltage requirements while maintaining consistent thermal and mechanical interface characteristics.
Direct substitutes include other MBR500 series variants such as MBR50020CTR or MBR50040CTR, provided the voltage rating aligns with the circuit requirements. Cross-brand replacements require careful verification of forward voltage, thermal resistance, and package dimensions to ensure compatibility.
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