MCU65P04-TP

Single FETs, MOSFETs Overview

The MCU65P04-TP is a P-channel MOSFET manufactured by Micro Commercial Components (MCC). It utilizes Trench Power LV MOSFET technology and is housed in a DPAK (TO-252) surface-mount package. The device features a drain-source breakdown voltage of -40 V and a continuous drain current rating of 65 A at a case temperature of 25°C. Key electrical parameters include a maximum on-resistance of 14 mΩ at VGS = -10 V and ID = -20 A, with a gate threshold voltage ranging from -1 V to -2.5 V. Thermal performance includes a junction-to-case thermal resistance of 1.3°C/W and a total power dissipation of 96 W at 25°C case temperature.

Single FETs, MOSFETs Feature Summary

• Trench Power LV MOSFET technology for high-density cell design
• Low on-resistance characteristics optimized for efficiency
• Robust thermal management capabilities within the DPAK package

Single FETs, MOSFETs Applications

• Power switching circuits requiring low-side or high-side control
• DC-DC converter topologies utilizing P-channel devices
• Motor driver interfaces and load switch applications

Single FETs, MOSFETs Procurement Notes

Verify component authenticity through authorized MCC distributors to avoid counterfeits. Confirm RoHS compliance status and specific tape-and-reel packaging quantities during ordering. Ensure storage conditions adhere to moisture sensitivity level requirements prior to assembly.

Single FETs, MOSFETs Selection Notes

Select this component for designs requiring a -40 V P-channel MOSFET with high current handling. Evaluate thermal constraints carefully as power dissipation ratings depend heavily on case temperature. Ensure gate drive voltages remain within the specified ±20 V limit to prevent dielectric breakdown.

Single FETs, MOSFETs Part Context

This part belongs to the MCU series of P-channel MOSFETs from Micro Commercial Components. It is designed for general-purpose power switching applications where low on-resistance and efficient heat dissipation are critical. The DPAK package provides a balance between current capacity and board space efficiency.

Single FETs, MOSFETs Replacement Considerations

Direct substitutes must match the -40 V rating, P-channel configuration, and TO-252/DPAK footprint. Verify that alternative components offer comparable RDS(on) values and thermal resistance specifications to maintain circuit performance integrity.