Microprocessors MPC755BPX350LE product image

MPC755BPX350LE

  • Description:IC MPU MPC7XX 350MHZ 360FCPBGA
  • Series:MPC7xx
  • Mfr:NXP USA Inc.
  • Package:Tray

SKU:bb05703f7db0 Category: Brand:

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MPC755BPX350LE is listed in the Microprocessors range at ChipApex. The manufacturer field lists NXP USA Inc.. Its product description is IC MPU MPC7XX 350MHZ 360FCPBGA. Review the specifications below when checking this part for your BOM.

Microprocessors specifications for MPC755BPX350LE

  • Description:IC MPU MPC7XX 350MHZ 360FCPBGA
  • Series:MPC7xx
  • Mfr:NXP USA Inc.
  • Package:Tray
  • Core Processor:PowerPC
  • Number of Cores/Bus Width:1 Core, 32-Bit
  • Speed:350MHz
  • Co-Processors/DSP:-
  • RAM Controllers:-
  • Graphics Acceleration:No
  • Display & Interface Controllers:-
  • Ethernet:-
  • SATA:-
  • USB:-
  • Voltage - I/O:2.5V, 3.3V
  • Operating Temperature:0°C ~ 105°C (TA)
  • Security Features:-
  • Mounting Type:Surface Mount
  • Package / Case:360-BBGA, FCBGA
  • Supplier Device Package:360-FCPBGA (25x25)
  • Additional Interfaces:-
  • Grade:-
  • Qualification:-

Microprocessors datasheet and documents for MPC755BPX350LE

MPC755BPX350LE

Microprocessors Overview

The MPC755BPX350LE is a PowerPC-based RISC microprocessor manufactured by NXP USA Inc. It features a single e600 core with a maximum clock frequency of 350 MHz and a 32-bit data bus width. The device utilizes a CBGA-360 package for surface mount installation. It includes 32 kB L1 instruction cache and 32 kB L1 data cache, alongside an internal L2 tag controller supporting external SRAMs of 256 kB, 512 kB, or 1 MB. Operating at a core voltage of 2 V, it supports I/O voltages of 2.5 V and 3.3 V. The component operates within a temperature range of -40°C to +105°C and holds AEC-Q100 qualification.

Microprocessors Feature Summary

  • Implements the PowerPC instruction set architecture with out-of-order execution capabilities
  • Integrates an internal L2 cache controller interface for external memory expansion
  • Supports multiple low-power management modes including doze, nap, and sleep states
  • Includes an integrated thermal management assist unit with on-chip sensor

Microprocessors Applications

  • Low-cost embedded systems requiring PowerPC compatibility
  • Automotive applications utilizing AEC-Q100 qualified components
  • Industrial control systems operating in extended temperature ranges

Microprocessors Procurement Notes

Verify the specific ordering suffix against the manufacturer's official documentation to confirm package type and speed grade. Ensure that the required L2 cache configuration matches the supported external SRAM interfaces. Confirm that the system design accommodates the specified core and I/O voltage requirements before procurement.

Microprocessors Selection Notes

Select this component when a single-core PowerPC solution with integrated L2 management is required. Compare performance metrics against the MPC745, which lacks the L2 cache interface. Consider the CBGA package availability and verify that the 350 MHz speed grade meets the system timing constraints.

Microprocessors Part Context

This microprocessor belongs to the MPC755 family, designed as a reduced instruction set computing (RISC) processor. It shares architectural similarities with the MPC745 but distinguishes itself through the inclusion of an internal L2 cache controller. The device targets applications needing efficient power management and robust thermal handling within a compact surface-mount form factor.

Microprocessors Replacement Considerations

Publicly confirmed substitute part numbers are not available in the provided source material.

MPC755BPX350LEMPC755BPX350LE

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