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The MRFE6VS25NR1 is a wideband RF power LDMOS transistor designed for ISM, broadcast, and aerospace applications. It operates from 1.8 to 2000 MHz with a drain-source voltage of 50 Vdc. The device delivers 25 W output power across its frequency range. Key electrical parameters include a drain-source breakdown voltage of 133 Vdc, a gate threshold voltage of 2.0 Vdc typical, and a maximum junction temperature of +225 °C. It utilizes a TO-270-2 plastic package.
Verify the specific ordering suffix R1 indicates shipping in a 500-unit reel with 24 mm tape width. Confirm the package variant matches the required lead configuration, as the GN suffix denotes gull wing leads formed for surface mount installation. Ensure compliance with RoHS and REACH SVHC requirements before finalizing procurement specifications.
Select this component for designs requiring high linearity and ruggedness in wideband amplifiers. The device supports both narrowband and broadband topologies. Consider the thermal management requirements given the junction-to-case thermal resistance. Verify that the system can handle the specified gate-source voltage limits and moisture sensitivity level during assembly.
This part belongs to NXP’s enhanced ruggedness platform of RF power LDMOS transistors. It is an N-channel enhancement-mode lateral MOSFET. The MRFE6VS25GNR1 is the gull-wing leaded variant of this device. Both versions share identical electrical characteristics and are intended for demanding RF power amplifier applications.
The MRFE6VS25GNR1 serves as a direct pin-compatible alternative with different lead forming for surface mount mounting.