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MSCMC120AM07CT6LIAG is listed in the FET, MOSFET Arrays range at ChipApex. The manufacturer field lists Microchip Technology. Its product description is MOSFET 2N-CH 1200V 264A SP6C LI. Review the specifications below when checking this part for your BOM.
The MSCMC120AM07CT6LIAG is a discrete semiconductor module from Microchip Technology, classified under MOSFET-SiC SBD Modules. It utilizes Silicon Carbide (SiC) technology and features an N-Channel configuration. The device is housed in the SP6C LI package with a base mount installation style. Key electrical parameters include a drain-source breakdown voltage of 1200V and a continuous drain current of 742A at case temperature. The on-resistance is specified as 2.85 milliohms at 600A and 20V gate-source voltage. The module supports a maximum power dissipation of 3200W at case temperature and operates within a junction temperature range of -40°C to 175°C.
Verify the specific suffix and package variant against the official Microchip datasheet to ensure compatibility with your thermal interface and mounting requirements. Confirm that the SP6C LI package dimensions match your mechanical design constraints. Cross-reference the electrical ratings with your system's peak load conditions to prevent overstress. Ensure that the sourcing channel provides authentic components with traceable documentation.
Select this component when high voltage blocking capability and high current handling are required in a compact form factor. The SiC technology offers advantages in high-temperature environments compared to traditional silicon devices. Consider the thermal resistance and mounting method when designing the heat sink interface. Evaluate the gate charge and switching speeds if high-frequency operation is a primary design goal.
This part belongs to the MSCMC120 series of discrete semiconductor modules from Microchip Technology. It is designed for robust performance in demanding power electronics applications. The series leverages Silicon Carbide technology to achieve superior efficiency and thermal stability. It serves as a critical component in systems requiring reliable high-power switching capabilities.
Consult the official Microchip replacement guide or datasheet errata for confirmed substitute part numbers. Do not assume cross-compatibility with other manufacturers' packages without verifying pinout and thermal specifications.
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