MSCSM70TAM19T3AG

FET, MOSFET Arrays Overview

The MSCSM70TAM19T3AG is a triple phase leg silicon carbide (SiC) MOSFET power module manufactured by Microchip Technology. It features an SP3F package with screw mount installation and isolated construction for direct heatsink mounting. The device provides a drain-source voltage of 700 V, continuous drain current of 124 A at 25 °C, and a maximum on-resistance of 19 mΩ. Operating junction temperature ranges from -40 °C to +175 °C. Key electrical parameters include a gate threshold voltage of 1.9 V, turn-on delay time of 40 ns, and turn-off delay time of 50 ns.

FET, MOSFET Arrays Feature Summary

• Triple phase leg configuration utilizing high-speed SiC MOSFET technology for ultra-low loss operation
• Aluminum Nitride substrate providing improved thermal performance and low junction-to-case resistance
• Kelvin source connection integrated for simplified gate drive circuitry
• Internal NTC thermistor included for precise temperature monitoring

FET, MOSFET Arrays Applications

• Welding converters
• Switched mode power supplies
• Uninterruptible power supplies
• EV motor and traction drive

FET, MOSFET Arrays Procurement Notes

Verify the specific datasheet revision DS00004610A when sourcing components to ensure alignment with final design specifications. Confirm that pin 20, pin 24, and pin 26 are properly shorted during assembly to establish the required three-phase bridge topology. Ensure all electrostatic discharge handling procedures are strictly followed during manufacturing and integration processes.

FET, MOSFET Arrays Selection Notes

Select this module for applications requiring high-frequency switching and compact form factors. The SP3F package supports direct mounting to heatsinks, reducing system complexity. Verify that the gate drive circuit accommodates the specified voltage limits and utilizes the Kelvin source terminal. Evaluate thermal management requirements against the provided thermal impedance curves to maintain safe operating temperatures.

FET, MOSFET Arrays Part Context

This component belongs to Microchip's series of silicon carbide power modules designed for advanced power electronics. It integrates multiple MOSFETs into a single isolated package to facilitate efficient three-phase inverter designs. The use of wide bandgap semiconductor material enables superior performance compared to traditional silicon devices in demanding industrial and automotive environments.

FET, MOSFET Arrays Replacement Considerations

No officially confirmed substitute part numbers are documented in the public datasheet.

FET, MOSFET Arrays FAQ

How must the control pins be configured for three-phase bridge operation?

Pin 20, pin 24, and pin 26 must be shorted together to perform a three-phase bridge.

What type of internal sensor is provided for thermal management?

An internal NTC thermistor is integrated into the module for accurate temperature monitoring.

Is the package electrically isolated for heatsink mounting?

Yes, the module features an isolated package design allowing for direct mounting to a heatsink.