Memory IC MSR820BJE288-10 product image

MSR820BJE288-10

  • Description:IC SRAM 576MBIT PAR 288FCBGA
  • Series:-
  • Mfr:MoSys, Inc.
  • Package:Tray

SKU:267a39c9617b Category: Brand:

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MSR820BJE288-10 is listed in the Memory IC range at ChipApex. The manufacturer field lists MoSys, Inc.. Its product description is IC SRAM 576MBIT PAR 288FCBGA. Review the specifications below when checking this part for your BOM.

Memory IC specifications for MSR820BJE288-10

  • Description:IC SRAM 576MBIT PAR 288FCBGA
  • Series:-
  • Mfr:MoSys, Inc.
  • Package:Tray
  • Memory Type:Volatile
  • Memory Format:SRAM
  • Technology:SRAM, RLDRAM
  • Memory Size:576Mbit
  • Memory Organization:8M x 72
  • Memory Interface:Parallel
  • Clock Frequency:-
  • Write Cycle Time - Word, Page:-
  • Voltage - Supply:-
  • Operating Temperature:-
  • Mounting Type:Surface Mount
  • Package / Case:288-BGA, FCBGA
  • Supplier Device Package:288-FCBGA (19x19)
  • Access Time:3.2 ns
  • Grade:-
  • Qualification:-

Memory IC datasheet and documents for MSR820BJE288-10

MSR820BJE288-10

Memory IC Overview

The MSR820BJE288-10 is a high-performance RLDRAM memory integrated circuit manufactured by MoSys, Inc. It provides a total storage capacity of 576 Mbit organized in a parallel interface configuration. The device features a fast access time of 3.2 ns, ensuring rapid data retrieval for demanding applications. It is housed in a 288-ball Flip Chip Ball Grid Array (FCBGA) package with dimensions of 19x19 mm, designed for surface-mount assembly.

Memory IC Feature Summary

  • Utilizes RLDRAM technology for high-speed parallel data transfer
  • Integrated on-die termination and signal integrity enhancements
  • Compact FCBGA packaging optimized for dense board layouts

Memory IC Applications

  • High-bandwidth networking equipment
  • Telecommunications infrastructure systems
  • Industrial control systems requiring fast memory access

Memory IC Procurement Notes

Verify the specific suffix '10' corresponds to the required speed grade and voltage specifications against the official datasheet. Confirm the 288-FCBGA package footprint matches your PCB design constraints. Ensure compatibility with existing system controllers supporting RLDRAM interfaces before procurement.

Memory IC Selection Notes

Select this component when system requirements demand high throughput and low latency memory solutions. Compare pinout and electrical characteristics with alternative RLDRAM variants to ensure seamless integration. Validate that the 3.2 ns access time meets the timing constraints of the host processor or controller.

Memory IC Part Context

This part belongs to the MoSys RLDRAM family, known for combining SRAM-like performance with DRAM density. The MSR series typically targets applications needing sustained high bandwidth. The BJE suffix indicates specific package and temperature range variations within the product line.

Memory IC Replacement Considerations

Consult official substitution guides for compatible RLDRAM devices from MoSys or other manufacturers. Verify electrical and mechanical compatibility before replacing. No direct public substitute part numbers are confirmed in available documentation.

MSR820BJE288-10MSR820BJE288-10

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