Memory IC MT29F8G08ABABAWP-AITX:B product image

MT29F8G08ABABAWP-AITX:B

  • Description:IC FLASH 8GBIT PARALLEL 48TSOP I
  • Series:-
  • Mfr:Micron Technology Inc.
  • Package:Tray

SKU:0674fc292d63 Category: Brand:

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MT29F8G08ABABAWP-AITX:B is listed in the Memory IC range at ChipApex. The manufacturer field lists Micron Technology Inc.. Its product description is IC FLASH 8GBIT PARALLEL 48TSOP I. Review the specifications below when checking this part for your BOM.

Memory IC specifications for MT29F8G08ABABAWP-AITX:B

  • Description:IC FLASH 8GBIT PARALLEL 48TSOP I
  • Series:-
  • Mfr:Micron Technology Inc.
  • Package:Tray
  • Memory Type:Non-Volatile
  • Memory Format:FLASH
  • Technology:FLASH - NAND
  • Memory Size:8Gbit
  • Memory Organization:1G x 8
  • Memory Interface:Parallel
  • Clock Frequency:-
  • Write Cycle Time - Word, Page:-
  • Voltage - Supply:2.7V ~ 3.6V
  • Operating Temperature:-40°C ~ 85°C (TA)
  • Mounting Type:Surface Mount
  • Package / Case:48-TFSOP (0.724", 18.40mm Width)
  • Supplier Device Package:48-TSOP I
  • Grade:-
  • Qualification:-

Memory IC datasheet and documents for MT29F8G08ABABAWP-AITX:B

MT29F8G08ABABAWP-AITX:B

Memory IC Overview

The MT29F8G08ABABAWP-AITX:B is an 8Gb (1G x 8) parallel NAND flash memory IC manufactured by Micron Technology Inc. It operates within a voltage range of 2.7V to 3.6V and supports an industrial temperature range of -40°C to 85°C. The component is housed in a 48-TSOP I package with a width of 18.40mm. It utilizes a parallel interface for data transfer and is classified as non-volatile flash memory. The device meets RoHS3 standards and has a moisture sensitivity level of 3.

Memory IC Feature Summary

  • Non-volatile storage architecture utilizing NAND flash technology
  • Parallel interface configuration for high-speed data access
  • Industrial-grade operational temperature capability
  • Compact surface-mount packaging design

Memory IC Applications

  • High-performance mass storage systems
  • Low-power embedded applications
  • Small form-factor electronic devices

Memory IC Procurement Notes

Verify the exact suffix against official Micron documentation to confirm pinout and electrical specifications, as variations exist within the family. Confirm RoHS3 compliance status for regulatory requirements. Check current product longevity program status to ensure availability for long-term production cycles. Validate package dimensions against PCB footprint designs prior to procurement.

Memory IC Selection Notes

Select this component for applications requiring high density and endurance in small form factors. Ensure system power supply remains within the specified 2.7V to 3.6V range. Verify that the host controller supports the required parallel interface protocol. Consider the industrial temperature rating if operation occurs in extreme environments compared to commercial grade alternatives.

Memory IC Part Context

This part belongs to the Micron MT29F8G08 series of NAND flash memories. It shares the base 8Gb capacity and parallel interface characteristics with other variants in the lineup. Differences typically lie in package types, such as TSOP versus BGA, and operating temperature ranges. It serves as a core storage solution for portable electronics and industrial controllers requiring reliable non-volatile data retention.

Memory IC Replacement Considerations

Direct substitutes include MT29F8G08ABACAWP-IT:C TR and MT29F8G08ABCBBH1-12:B. Verify package compatibility, as the latter uses a 100-VBGA format. Ensure functional equivalence regarding the parallel interface and voltage specifications before substitution.

MT29F8G08ABABAWP-AITX:BMT29F8G08ABABAWP-AITX:B

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