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NDS8852H is listed in the FET, MOSFET Arrays range at ChipApex. The manufacturer field lists onsemi. Its product description is MOSFET N/P-CH 30V 4.3A 8SOIC. Review the specifications below when checking this part for your BOM.
The NDS8852H is a complementary MOSFET half bridge device manufactured by onsemi, originally developed by Fairchild Semiconductor. It integrates an N-channel and a P-channel enhancement-mode MOSFET in a single 8-SOIC surface-mount package. The N-channel component provides a continuous drain current of 4.3A with a maximum drain-source voltage of 30V and an on-resistance of 0.08Ω at VGS=10V. The P-channel counterpart supports -3.4A with identical voltage ratings and an on-resistance of 0.13Ω at VGS=-10V. Both transistors operate within a junction temperature range of -55°C to 150°C.
Verify the specific ordering suffix against the manufacturer's official documentation to confirm packaging options and tape-and-reel specifications. Confirm RoHS compliance status as the product may be classified as obsolete or non-compliant depending on the manufacturing date code. Ensure that the sourcing channel provides traceable documentation matching the original Fairchild Semiconductor part identification.
Select this component when a matched pair of N-channel and P-channel MOSFETs is required for low-voltage switching applications. The integrated design ensures balanced electrical characteristics between the two channels. Verify that the 30V breakdown voltage and 4.3A current rating align with the specific load requirements of the target circuit design.
This component belongs to the NDS885 series of complementary MOSFET arrays. Originally produced by Fairchild Semiconductor, the product line was transferred to onsemi following corporate acquisitions. The datasheet revision history indicates updates from preliminary information to full production specifications before eventual discontinuation.
Publicly confirmed substitute part numbers are not available in the provided source material. Designers should consult the manufacturer's obsolescence notices or cross-reference databases for equivalent complementary half-bridge devices.
The maximum power dissipation is 2.5W for a single device under standard thermal conditions.
The on-resistance increases as the junction temperature rises, with typical values rising from 0.08Ω at 25°C to approximately 0.13Ω at 125°C for the N-channel device.
The total gate charge (Qg) for the N-channel device is typically 9.5nC and has a maximum value of 27nC when tested at VDS=10V, ID=3.4A, and VGS=10V.
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