NE85630-R24-A

Overview

The NE85630-R24-A is a Real-Time Clock (RTC) integrated circuit manufactured by Renesas Electronics, distributed under the CEL brand. It is designed for surface-mount technology (SMD/SMT) applications and provides precise timekeeping functions. The component operates within a specified temperature range and includes features for maintaining accurate date and time data. Official documentation identifies it as part of the RTC product category with specific interface and packaging attributes defined by the manufacturer.

Feature Summary

• Provides real-time clock functionality for system timing
• Designed for surface-mount installation on printed circuit boards
• Maintains accurate time and date information

Applications

• General purpose timekeeping in electronic systems
• Data logging timestamping
• System event scheduling

Procurement Notes

Verify the manufacturer designation carefully, as this component is produced by Renesas Electronics and may be listed under different distributor brands. Confirm the exact suffix and package type against official datasheets to ensure compatibility with your design requirements before ordering.

Selection Notes

Select this component when a dedicated RTC solution is required for SMD assembly. Ensure the operating voltage and temperature specifications meet the environmental conditions of the target application. Cross-reference the pinout and interface requirements with the system microcontroller or processor being used.

Part Context

This device belongs to the family of Real-Time Clock ICs offered by Renesas Electronics. These components are widely used in consumer electronics, industrial equipment, and computing devices where reliable timekeeping is essential. The specific model indicates a particular variant within this broader product line.

Replacement Considerations

Check for direct pin-to-pin replacements from Renesas or other manufacturers offering compatible RTC ICs. Verify that any substitute maintains the same interface protocol, voltage levels, and package dimensions to ensure seamless integration without PCB redesign.