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NIMD6001NR2G is listed in the FET, MOSFET Arrays range at ChipApex. The manufacturer field lists onsemi. Its product description is MOSFET DRIVER 60 V, 3.3 A 130 MO. Review the specifications below when checking this part for your BOM.
The NIMD6001NR2G is a dual N-channel MOSFET array manufactured by onsemi, designed for surface-mount applications in an 8-SOIC package. It features a drain-source voltage (Vdss) of 60V and a continuous drain current (Id) of 3.3A at the maximum junction temperature. The device exhibits a maximum gate threshold voltage (Vgs(th)) of 3V at 250µA and a typical gate charge (Qg) of 9nC at 5V. Input capacitance (Ciss) is specified as 175pF at 15V. The component operates within a temperature range of -55°C to 150°C and holds AEC-Q101 automotive qualification.
Verify component authenticity through authorized distribution channels or direct manufacturer engagement. Confirm specific ordering suffixes match exact package and tape-and-reel specifications. Request official datasheets and quality certificates to ensure compliance with automotive standards. Validate lot traceability and RoHS status prior to integration into production schedules.
Evaluate thermal management requirements against the 150°C maximum junction temperature limit. Ensure gate drive voltages remain within specified thresholds to maintain optimal Rds(on) performance. Consider the 8-SOIC footprint constraints during PCB layout design. Verify that system voltage levels do not exceed the 60V drain-source rating under all operating conditions.
This component belongs to the NIMD6001 series of dual MOSFET arrays from onsemi. The series provides integrated solutions for space-constrained designs requiring multiple switching elements. Variants within this family share similar electrical profiles but may differ in packaging options or specific parameter tolerances defined by the manufacturer.
Cross-reference with NIMD6001ANR2G for potential functional compatibility. Verify pinout alignment and electrical parameter equivalence before substitution. Consult official replacement guides to confirm package integrity and thermal characteristics match the original design requirements.
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