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Product Detailed Parameters
- Description：IC MODULE PIM 350A 1000V
- Series：-
- Mfr：onsemi
- Package：Tray
- IGBT Type：Trench Field Stop
- Configuration：Three Level Inverter
- Vce(on) (Max) @ Vge, Ic：1.8V @ 15V, 375A
- Input：Standard
- NTC Thermistor：Yes
- Operating Temperature：-40°C ~ 150°C (TJ)
- Mounting Type：Chassis Mount
- Package / Case：Module
- Supplier Device Package：42-PIM/Q2PACK (93x47)
- Voltage - Collector Emitter Breakdown (Max)：1000 V
- Current - Collector (Ic) (Max)：303 A
- Power - Max：592 W
- Current - Collector Cutoff (Max)：1 mA
- Input Capacitance (Cies) @ Vce：24.146 nF @ 20 V
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Overview
The NXH350N100H4Q2F2SG is a three-level NPC Q2Pack module from onsemi, integrating high-performance IGBTs with rugged anti-parallel diodes. It utilizes trench field-stop technology for low switching loss and high power density. The module features a 1000 V collector-emitter voltage rating and includes an integrated NTC thermistor for thermal monitoring. Outer IGBTs support a continuous current of 303 A at TC=80°C, while inner IGBTs handle up to 329 A under the same conditions. The package offers a low inductive layout and operates within a junction temperature range of -40°C to +150°C.
Feature Summary
- Integrates high-performance IGBTs with rugged anti-parallel diodes in a compact design
- Utilizes extremely efficient trench field-stop technology to reduce system power dissipation
- Features a low inductive layout and low package height for high power density
- Includes an integrated NTC thermistor for precise thermal management
Applications
- Solar inverters
- Uninterruptible power supply systems
Procurement Notes
Verify the specific ordering suffix 'SG' corresponds to solder pins rather than press-fit variants when sourcing replacements. Confirm RoHS compliance status directly through official documentation channels. Ensure that the procurement specifications align with the required pin configuration and packaging details provided by the manufacturer.
Selection Notes
Select this module for applications requiring high power density and low switching losses. Evaluate the thermal resistance characteristics against the specific heatsink requirements. Consider the integrated NTC thermistor for accurate temperature monitoring in critical power conversion designs.
Part Context
This component belongs to the NXH350N100H4Q2F2 series, which encompasses both press-fit (PG) and solder-pin (SG) configurations. It is part of onsemi's EliteSiC product line, designed for high-efficiency power conversion. The module represents a significant advancement in three-level NPC topology integration.
Replacement Considerations
NXH350N100H4Q2F2PG serves as the direct alternative with identical electrical characteristics but utilizes press-fit pins instead of solder pins. Verify mechanical compatibility before substitution.
