OSD3358-512M-BSM

Microcontrollers, Microprocessor, FPGA Modules Overview

The OSD3358-512M-BSM is a System-in-Package (SiP) module manufactured by Octavo Systems. It integrates an AM3358 ARM Cortex-A8 processor, 512MB DDR3 memory, and a TPS65217B power management unit into a single package. This design consolidates the processing core, volatile memory, and power regulation to reduce printed circuit board area and simplify hardware architecture for embedded applications.

Microcontrollers, Microprocessor, FPGA Modules Feature Summary

• Integrates Texas Instruments AM3358 ARM Cortex-A8 processor
• Includes 512MB DDR3 memory within the package
• Features integrated TPS65217B power management IC
• Utilizes System-in-Package technology to minimize PCB footprint

Microcontrollers, Microprocessor, FPGA Modules Applications

• Industrial automation controllers
• Medical instrumentation systems
• Portable consumer electronics devices

Microcontrollers, Microprocessor, FPGA Modules Part Context

This component belongs to the OSD335x family of SiP modules from Octavo Systems. The specific OSD3358-512M-BSM variant is distinguished by its 512MB memory configuration and BSM suffix, which typically denotes the specific package or thermal variant within the product line.

Microcontrollers, Microprocessor, FPGA Modules Replacement Considerations

Direct replacements must match the AM3358 processor core and 512MB DDR3 capacity. Verify pin compatibility with existing carrier boards when substituting with other OSD335x variants.