RS1MLS RVG

Single Diodes Overview

The RS1MLS RVG is a fast recovery rectifier manufactured by Taiwan Semiconductor Corporation. It features a maximum average forward rectified current of 1.2 A and a repetitive peak reverse voltage of 1000 V. The device exhibits a typical reverse recovery time of 300 ns and a maximum non-repetitive peak forward surge current of 50 A. It is housed in an SOD-123HE surface-mount package with a maximum DC forward voltage drop of 1.3 V at rated current.

Single Diodes Feature Summary

• Fast reverse recovery characteristics for efficient switching applications
• Glass passivated chip junction for enhanced reliability
• Halogen-free construction compliant with environmental directives

Single Diodes Applications

• High-frequency power supply circuits
• DC-DC converter output rectification
• Free-wheeling diode applications in inductive loads

Single Diodes Procurement Notes

Verify the specific suffix RVG to confirm halogen-free status and packaging configuration. Ensure compatibility with SOD-123HE footprint dimensions during PCB layout. Confirm RoHS compliance documentation matches the manufacturing batch requirements for your assembly process.

Single Diodes Selection Notes

Select this component when high voltage blocking capability and moderate current handling are required in a compact surface-mount form factor. The 1000 V rating provides robust protection against voltage transients, while the 300 ns recovery time supports higher frequency operation compared to standard rectifiers.

Single Diodes Part Context

This part belongs to the RS1M series of fast recovery rectifiers from Taiwan Semiconductor. The series offers various voltage ratings within the same package family, allowing designers to maintain consistent board layouts while adjusting voltage specifications for different circuit requirements.

Single Diodes Replacement Considerations

Direct substitutes include other 1000V 1.2A fast recovery diodes in SOD-123 packages such as the MUR1100 or FR107 variants, provided pinout and thermal characteristics match the original design constraints.